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| ![]() VORAGO Technologies Awarded Two NASA Small Business Innovation Research (SBIR) ProjectsThe two projects that are now underway are consistent with VORAGO's technology expertise and commercial objectives. VORAGO will create a rad-hard I/O Expansion Chip for next generation spaceflight processor devices, including the High-Performance Spaceflight Computing (HPSC) Chiplet. VORAGO will also harden an existing proven commercial Flash memory technology that is available from a US-based Trusted CMOS wafer fab. VORAGO is also currently engaged in a SBIR Phase II project with NASA to to design a radiation-hardened miniaturized System-In-Package (SIP). The SIP is optimized for size, weight, power consumption and radiation hardness. "We are delighted that NASA has selected VORAGO Technologies to undertake these important projects," said Bernd Lienhard, chief executive officer of VORAGO Technologies. "HARDSIL technology is a perfect solution to quickly and cost effectively create radiation-hardened semiconductors devices for use in challenging space environments." About VORAGO Technologies VORAGO Technologies is a privately held, high-technology company based in Austin, TX with patented and proven solutions that enable electronics systems for extreme temperature and radiation environments. Semiconductor device operation in an extreme radiation environment is enabled by the use of VORAGO's HARDSIL® technology. HARDSIL uses standard manufacturing equipment with no negative impact on performance or yields. This approach is a highly cost-effective and fast alternative to conventional rad-hard by design (RHBD) techniques, specialized wafer fabrication processes, up-screened commercial products, redundant systems, or mechanical shielding. Learn more at www.voragotech.com. Contact SBIR Priciple Investigator : Ross Bannatyne contact: rbannatyne@voragotech.com ***@voragotech.com +1 512 550 2954 End
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