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November 2019
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457 views, By Goke US Lab
Goke US Laboratories announced the issuance of US Patent Number 10452871 for "Method and Apparatus for Data Encryption Using Standardized Data Storage and Retrieval Protocol".
12791297
503 views, By Bio-Signal Technologies, LLC
Research Tools for Monitoring and Controlling the Nervous System
12792308
479 views, By Copperhill Technologies Corp.
Copperhill Technologies announced the release of its JCOM.DUE.CORE gateway, a programmable embedded system based on the Arduino Due, supporting two USB and two CAN Bus ports.
12791273
389 views, By Goke US Lab
As the industry's leading provider of SSD controllers and storage solutions, Goke Microelectronics was invited to the 2019 Flash Memory Summit to demonstrate an– ultra-low latency NVMe SSD based on Toshiba Memory's XL-FLASH memory.
12791052
275 views, By AI Technology, Inc.
 Hyper-conductive Conductive Coating for Package Level EMI Shielding  90dB+ EMI Shielding Effectiveness from MHz to Millimeter GHz at
217 views, By Intensivate Inc.
A PCIe card containing 21 server nodes based on patented technology and RISC-V
12789434
321 views, By Copperhill Technologies Corp.
Copperhill Technologies announced the release of its PiCAN3 CAN-Bus Board for the Raspberry Pi 4, adding Controller Area Network capabilities plus a real-time clock to the new Raspberry CPU.
402 views, By AI Technology, Inc.
• First UV Releasing Wafer Processing Adhesive Capability for Wafer Processing Up to 270ºC • First Peel Release Format Wafer Processing Adhesive to Provide Processing Up to 330ºC • First Rinse-Free and Residual Free Wafer Processing Adhesive in...
299 views, By VORAGO Technologies
VORAGO Technologies, a leading provider of radiation- hardened embedded systems technology, has been awarded a new NASA Small Business Innovation Research (SBIR) Phase II grant by the National Aeronautics and Space Administration (NASA).
12786386
335 views, By AI Technology, Inc.
World thinnest c-DAF at 10 micron thickness with outstanding melt-flow for ease of wafer lamination. Proven UV and peel release dicing tape compatibility for easy roll lamination onto wafer with dicing tape before dicing and singulation.

All Press Releases

43 views, By GOWIN Semiconductor Corp.
GOWIN Semiconductor Corp., the world's fastest-growing programmable logic company, announces the release of their latest mSoC FPGA with integrated Bluetooth 5.0 Low Energy radio enabling an entirely new wave of FPGA computing capabilities at the edge.
60 views, By Machine Vision Products, Inc.
Vista, CA, USA: Machine Vision Products today announced it would be demonstrating its true flexibility and powerful inspection capabilities with a wide variety of applications at the Productronica 2019 exhibition from Nov 12-15 in Munich
53 views, By KBV Research
The Global Body Area Network Market size is expected to reach $17 billion by 2025, rising at a market growth of 11.6% CAGR during the forecast period.
51 views, By The Information Network
NEW TRIPOLI, PA…5G smartphones will increase from just 13 million units in 2019 to 900 million in 2024, according to the report "Hot ICs: A Market Analysis of Artificial Intelligence, 5G, CMOS Image Sensors, and Memory Chips," recently published by The...
44 views, By KBV Research
The Global 3D Projector Market size is expected to reach $4.6 billion by 2025, rising at a market growth of 7.6% CAGR during the forecast period.
47 views, By GD Rectifiers
We share Semikron's latest wind turbine technology developments
457 views, By Goke US Lab
Goke US Laboratories announced the issuance of US Patent Number 10452871 for "Method and Apparatus for Data Encryption Using Standardized Data Storage and Retrieval Protocol".
70 views, By GOWIN Semiconductor Corp.
GOWIN Semiconductor Corp., the world's fastest growing FPGA company, will attend ET & IoT Technology 2019, held in PACIFICO YOKOHAMA, JAPAN from 20 -22 November 2019 at booth number B-15 ET (Embedded Technology) & IoT Technology 2019 is one of...
82 views, By GD Rectifiers
Discover five simple ways to strengthen your supply chain today
62 views, By American Microsemiconductor, Inc
American Microsemiconductor is proud to feature a variety SCRs from VPT Components.
382 views, By The Information Network
On the heels of a 14% growth in semiconductor equipment growth in 2018, the market is forecast to drop 17% in 2019 to $54 billion, according to the report "The Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts," recently published..
70 views, By KBV Research
The Global Shock Sensors Market size is expected to reach $1.6 billion by 2025, rising at a market growth of 16.6% CAGR during the forecast period.
66 views, By Toradex
Toradex announced general availability for its Apalis SoM based on the NXP i.MX 8QM SoC, highest performance variation of the i.MX 8 family.
12791297
503 views, By Bio-Signal Technologies, LLC
Research Tools for Monitoring and Controlling the Nervous System
12792308
479 views, By Copperhill Technologies Corp.
Copperhill Technologies announced the release of its JCOM.DUE.CORE gateway, a programmable embedded system based on the Arduino Due, supporting two USB and two CAN Bus ports.
12791273
389 views, By Goke US Lab
As the industry's leading provider of SSD controllers and storage solutions, Goke Microelectronics was invited to the 2019 Flash Memory Summit to demonstrate an– ultra-low latency NVMe SSD based on Toshiba Memory's XL-FLASH memory.
12791052
275 views, By AI Technology, Inc.
 Hyper-conductive Conductive Coating for Package Level EMI Shielding  90dB+ EMI Shielding Effectiveness from MHz to Millimeter GHz at
68 views, By American Miccrosemiconductor, Inc.
With the goal of providing the best products to its customers, American Microsemiconductor has been franchised for VPT Components' semiconductors.
64 views, By k-Space Associates, Inc.
k-Space Associates, Inc. is proud to announce that the kSA Emissometer ex situ metrology tool for MOCVD carrier characterization now has ultraviolet (UV) photoluminescence (PL) capabilities for even better carrier evaluation.
217 views, By Intensivate Inc.
A PCIe card containing 21 server nodes based on patented technology and RISC-V
81 views, By GD Rectifiers
Discover how working with the right design engineering partner could help save you time and money
12789434
321 views, By Copperhill Technologies Corp.
Copperhill Technologies announced the release of its PiCAN3 CAN-Bus Board for the Raspberry Pi 4, adding Controller Area Network capabilities plus a real-time clock to the new Raspberry CPU.
77 views, By GD Rectifiers
Sirio IC pulse drive transformers, switch mode transformers, current transformers and inductors at competitive prices with fast delivery
402 views, By AI Technology, Inc.
• First UV Releasing Wafer Processing Adhesive Capability for Wafer Processing Up to 270ºC • First Peel Release Format Wafer Processing Adhesive to Provide Processing Up to 330ºC • First Rinse-Free and Residual Free Wafer Processing Adhesive in...
64 views, By KBV Research
The Global Night Vision Devices Market size is expected to reach $9.9 billion by 2025, rising at a market growth of 8.3% CAGR during the forecast period.
84 views, By GD Rectifiers
Technology changes, shorter product life cycles and the consolidation of designs could result in more components reaching end of life
68 views, By Test and Verification Solutions Ltd
T&VS were approached by Wellwise looking for QA delivery best practice to help enable the delivery of an industry leading IoT solution.
74 views, By KBV Research
The Global Motion Sensors Market size is expected to reach $8.8 billion by 2025, rising at a market growth of 8.2% CAGR during the forecast period.
113 views, By GOWIN Semiconductor Corp.
GOWIN Semiconductor, the world's fastest-growing and most innovative FPGA company, will attend the highly renowned FPGA World Conference in Stockholm on September 17th.
70 views, By KBV Research
The Global Position Sensor Market size is expected to reach $8 billion by 2025, rising at a market growth of 8.6% CAGR during the forecast period.
299 views, By VORAGO Technologies
VORAGO Technologies, a leading provider of radiation- hardened embedded systems technology, has been awarded a new NASA Small Business Innovation Research (SBIR) Phase II grant by the National Aeronautics and Space Administration (NASA).

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