In the production of multilayer PCB electroplating about tin protection technology

Aug. 7, 2011 - PRLog -- Multilayer PCB fabrication process, always inseparable from the protection of material technology. Including manufacture process in electroplating protection technology, high polymer synthesis materials protection technology and production is completed product non-metallic material protection technology. Along with the customer of multilayer PCB quality requirements, and the continuous improvement of environmental protection and economic benefits etc DuoFang factors to consider, prompting multilayer PCB production technology continuous innovation and improvement. In the multilayer PCB fabrication of figure in the line after plating copper plating layer lead tin/pure tin protection technology, is one example.

This so the specially designed additive is before the acidic fluorine boric acid salt lead-tin alloy plating technology, its shortcoming is fluorinated boric acid and tin, fluorine boric acid lead and fluorine boric acid and drug that causes remove coating difficult, in addition to the operator"s health and sewage treatment is adverse. Currently USES the pure tin plating technology, is green (no need to age, odourless, chlorine lead-free), both overcome the disadvantages of copper plating, and play a good protection. This paper introduces the technique in the foundation, on the pure tin plating process quality control, product quality and the reason of the measures taken to simply introduced.
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Section 2.3.1 for ammeters tin plating liquid and composition of the operating conditions
2.2.2 tin slot opening cylinder method
First half A cylinder, distilled water to slowly add 98 L quality score for 98% of sulfuric acid, join after mixing cooling 40 kg Tin Salt to 25 ° C 235 cooling, to join 76 L Sulfotech again A, B, Solfotech 15.2 L "ts 30.4 L Sulfolyt, add Additive athletes distilled water to liquid level, circulation (1.5 A/dm2 electrolysis 2 AH/L).
Tin slot 2.2.3 maintenance and control of the solution
Before work analysis tin and sulphuric acid. Every deal with 100 m2 plank need to add 11 L sulfuric acid, 600 g Tin Salt 235, 600 mLSulfotech again A, 800 mL Sulfotech again B, 750 mL athletes Sulfolyt Additive. Automatically adds the system according to the 200 AH add 56 mL Sulfotech again A.
The solution must be hull bin test every week, observe Sulfotech adjustment again A, B Sulfotech again.

The best value to the project scope
Sn2 + 20-30 mL/L 24 mL/L
W (H2SO4) is 98% 160 185 mL/L 175 mL/L
Acid tin additives (Sulfotech again A) A 30 to 60 mL/L 40 mL/L
Acid tin additives (Additive Sulfolyt) athletes athletes to 30 to 80 mL/L 40 mL/L
Acid tin additives B (Sulfotech again B) 15-25 mL/L 20 mL/L
Operating temperature 18-25 ° C 22 ° C
Cathodic current density 1.3-2. ASD 1.7 ASD
Source from PCB manufacturer: http://www.raypcb.com  
Keywords:PCB,printed circuit boards,China PCB,PCB manufacturing,Express PCBs,PCB manufacturers

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RayMing PCB - www.raypcb.com . RayMing Technology (HK) Co., Ltd is a professional High-tech PCB Manufacturer of single-sided, double-sided and multilayer printed circuit boards(up to 20L), and some high end boards,