Mobile phone folding place design FPC will bring

Sept. 14, 2011 - PRLog -- The following is my old practice reportAs is known to all, the use of mobile phone folding FPC need very good flexibility, because the ministry of information industry of the flip phone labeled requirement is 50000 times life, and at present domestic a phone line this requirement is 8-factory 100000 times. So FPC is influence flip phone quality a key factor. In fact, the flip phone labeled life not fully determined in FPC, accurate said it should be the axis of the institutions with FPC coordination. So, the root of way should be in the mobile phone manufacturer FPC mechanism design at the same time to get involved, but it is hard to do. So we"ll discuss the FPC first.

1) the choice of materials: to ensure the performance, bend suggestion choice 0.5 0.5 oz of single-side mil-/ boards, rolling copper (RA); Layer (covering film) care to choose 0.5 mil-

2) layer choice: the cell phone is the general labeled 40 of actual go by PIN, in article 34 line 40, between the shape of article FPC width is 3.2-4 mm; If the three mil-line width, 40 line, is as long as there is 3.6 mm width can be designed into two layers of lines. 0.5 oz, 3 mil-line width resistance to current strength for 70 UA.

3) bend area line design:
A) need to bend part can"t have through holes;
B) the additional protection on both sides of the line, if the space is insufficient, copper wire choice in bend part of the additional protection in R Angle copper wire.
C) in a circuit connection parts should be designed to curve.

4) bend area design (air gap) : bend area should do layering design, will glue take out, easy to spread the role of stress. Bend in the area do not affect the assembly, the bigger the better.

5) shielding layer design: the mobile phone screen layer generally USES the silver and copper foil slurry, Japanese mobile phone have use up design.
A) with a silver plasma screen layer, reduce the activities of the actual layer, easy to assemble, simple technology and low cost. But the silver slurry mixture of is because, resistance on the high side, in about one ohm. So can not directly with silver slurry design layers to do ground.
B) copper foil shield, layer number two layer increased activity, cost increased, but the resistance is low, can be directly designed to landlines. C) all screen layer, the cost too is high.

6) electroplating choice: to ensure that bend performance, must choose part copper plating processes. Cannot use the comprehensive copper plating processes

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