PCB non-electrolytic nickel coating requirements

Gold surface, sedimentation of the ultimate goal of the circuit is formed between the PCB and the components of physical strength, electrical characteristics of a good connection.
By: raypcb
 
Aug. 21, 2011 - PRLog -- Non-electrolytic nickel coating should be completed in several functions:
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Gold surface, sedimentation of the ultimate goal of the circuit is formed between the PCB and the components of physical strength, electrical characteristics of a good connection. If there is any surface oxide or PCB contamination, the connection of the welding flux is weak today will not happen. Kim natural precipitation in the nickel above and will not in the long-term storage of oxidation. However, money is not deposited on top of nickel oxide, it must be in the nickel bath of nickel (nickel bath) and between pure gold dissolution. This is the first requirement of nickel oxide long enough to keep no time to allow the precipitation of gold. Components developed chemical bath to allow precipitation of nickel in 6 to 10% of the phosphorus content. Non-electrolytic nickel-phosphorus coating in the bath as a control, oxides, and the electrical and physical characteristics of the careful balance of considerations. Non-electrolytic nickel coating surface hardness with the physical strength required in many applications, such as automotive transmission bearings. PCB needs of these applications is far from rigorous, but for wire bonding (wire-bonding), touch pad contact points, plug-in connectors (edge-connector) and handling sustainability, a certain hardness is important. Wire bonding requires a hardness of nickel. If the lead to sediment deformation, friction losses may occur, it helps lead "melt" to the substrate. SEM images show no penetration to the surface of nickel / gold or nickel / palladium (Pd) / gold surface. Electrical characteristics as easily, copper is selected as the formation of the metal circuit. Conductivity of copper is superior in almost every metal. Kim also has good conductivity, it is the perfect choice for the outer metal, as e tends to surface in a flow of conductive lines ("layer" efficiency). Copper 1.7 μΩcm Gold 2.4 μΩcm Ni 7.4 μΩcm non-electrolytic nickel coating 55 ~ 90 μΩcm Although most of the board of the electrical characteristics of the production from nickel layer effects, nickel can affect the electrical characteristics of high-frequency signals. Microwave PCB signal loss can exceed the specifications of designers. This phenomenon is proportional to the thickness of Ni - Nickel circuit to pass through to reach the solder points. In many applications, electrical signals can be provided back to the nickel precipitation is less than 2.5μm within design specifications. Contact resistance, contact resistance and solderability different, because the Ni / Au surface in the entire life of the end product maintain no welding. Ni / Au in the long-term environmental exposure to external contacts must be maintained after the conductivity. 1970 Antler work to quantify the Ni / Au contact surface requirements. Of a variety of end-use environment: 3 "65 ° C, at room temperature to work a normal electronic system the maximum temperature, such as computer; 125 ° C, universal connector, the temperature must work, often required for military applications; 200 ° C, the temperature on the flight equipment is becoming increasingly important. "For the low-temperature environment, no nickel barrier. As the temperature increases, requirements to prevent the Ni / Au increase in the number of nickel transfer. Ni barrier layer of satisfaction when 65 ° C 125 ° C when the contacts touch of satisfaction satisfaction 200 ° C when the contact with 0.0 μm 100% 40% 0% 0.5 μm 100% 90% 5% 2.0 μm 100% 100% 10% 4.0 μm 100% 100% 60%

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