Hyper-conductive Coating for Component Level EMI/RFI Shielding
Hyper-conductive Conductive Coating for Package Level EMI Shielding
90dB+ EMI Shielding Effectiveness from MHz to Millimeter GHz at <10-micron Thickness
Hyper-conductive EMI Shielding with Complementary Supporting Materials for Precision Coating on 5-Sides of the Components
With the advances of 5G and the coming 6G cellular and wireless Internet communication that operates at 6GHz and higher, the need of effective RF electromagnetic interference (RFI/EMI) shielding between the devices onboard of the cellular, computer and communication devices that have high shielding effectiveness, cost effective and spacing saving becomes more demanding.
EMC 8660 is designed to be precision coated and cured onto components ready for direct mounting and soldering at board level. These advanced hyper-conductive coating yield the required high shielding effective for the 4G and 5G cellular products.
Component Package Level Conductive Spray Coating Requires a Sealing Pad for Protection and Handling
In order to completely covering all 5 sides without affecting contact interconnection interface surface, precision jet-spray of the conductive coating must provide precision coating without sipping. The solder balls and contact pins on interconnection interface side must be sealed off from jet-spray coating.
AIT provides complementary component package supporting conformable carrier material that will "absorb" the interconnection studs or solder balls that can be heat release easily after the curing temperature and process for the epoxy-based conductive coating. Needs a conformable sealing pad allowing the package solder balls and pins submerged.
With over 35 years in providing EMI/RFI shielding coating and sealant to military electronics, AIT has one of the most extensive experience in providing these component package level shielding applications.
For more information on AIT 5G conductive coating for components:
For an application analysis:
AI Technology, Inc. (AIT) Web Address:
Maurice Leblon, AI Technology, Inc.
+1 609 799 9388