AIT Introduces World Thinnest (10-micron) Conductive Die-Attach Film (c-DAF) for Wafer Level High Power Die-Attach Application

World thinnest c-DAF at 10 micron thickness with outstanding melt-flow for ease of wafer lamination. Proven UV and peel release dicing tape compatibility for easy roll lamination onto wafer with dicing tape before dicing and singulation.
PRINCETON, N.J. - Aug. 28, 2019 - PRLog -- AIT is proud to introduce the availability of volume production of world thinnest 10-micron thick die-attach film adhesives, WL-ESP8660-FP with the same molecular structure as that of the more traditional 20 micron and thicker die-attach film adhesive. With intrinsic thermal conductivity of more than 8 W/M-ºK and higher melt-flow to provide one of the lowest thermal impedance between power chip and substrate.

Wafer Level DAF and DDAF Roll-Lamination with Dicing Tape for High Power Processors and Die Attach Application
WL-ESP8660-FP is designed for wafer level application of the die-attach film with moderate wafer lamination at 75ºC -85ºC. Post wafer lamination, the die-attach film retains its ambient temperature storage useful life of 12 months.

Compatible dicing tapes include some common UV releasing types and peel-release types with specific peel strength. They can be laminated at ambient or elevated temperature up to the wafer lamination temperature. They can also be supplied in a pre-applied dicing tape or DDAF format.

Proven Molecular Structure with Stress Absorbing Capability for High Reliability
The molecular structure of WL-ESP8660-FP is the same as that of the standard and proven thicker version of ESP-ESP8660 having several molecular relaxation mechanisms to provide ability to absorb interfacial stresses between die and substrate that has substantial thermal expansion coefficient differential.

Low Moisture Absorption and Resistant for Level 1 MSL Packaging Capability
WL-ESP8660-FP also maintains the same low moisture absorption of less than 0.1% by weight and maintains the same bond strength and reliability even when exposed to 85ºC/85% exposure for more than 168 hours. This low moisture susceptibility property enables devices to pass the Level 1 of MSL packaging reliability.

For more information on the conductive die-attach film for wafer level packaging technology and solution:

For an application analysis:

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Media Contact
Maurice Leblon,,
AI Technology, Inc.
+1 609 799 9388


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