Multi-Chip Packaging Expected to be a Major Trend in the Global 3D IC Market: TechNavio

The Global 3D IC Market is expected to grow at a CAGR of 18.4 percent during the forecast period, according to TechNavio.
 
 
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Tags:
* Integrated Circuits
* ic
* Semiconductors
* 3d
* Market Research

Industrys:
* Semiconductors
* Technology

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* London City - London, Greater - England

Subject:
* Reports

LONDON - Oct. 8, 2014 - PRLog -- TechNavio, a global tech-focused research firm has announced the publication of its market research report on the Global 3D IC Market 2014-2018.

3D ICs are the perfect solution for meeting the growing demand of minimizing the size and reducing the cost of consumer electronics products. In these ICs, the transistor density is kept higher so as to offer better performance. The Global 3D IC Market is expected to grow at a CAGR of 18.4 percent during the forecast period.

About the Report

The latest report by TechNavio focuses on an increase in demand for 3D ICs in memory products, as they improve the performance and reliability of memory products, reduce cost and size and enable high memory capacity. The report also highlights the emerging trend of multi-chip packaging that allows more transistors to be packed into a single 3D IC.

“This packaging is important for memory-enhanced applications because it enables improved interaction between the memory and the processor. Multi-chip packaging is expected to be a promising approach for most applications in the future of this market,” says Faisal Ghaus, Vice President of TechNavio.

Key Information Covered in the Report:

·         Market segmentation, size and forecast through 2018

Market segmentation, size and forecast through 2018

Market Growth Drivers:

-Increased Demand for Memory-enhanced Applications.

-For a full detailed list, view our report.

Market Challenges:

-Thermal Conductivity Issues.

-For a full detailed list, view our report.

Market Trends:

-Multi-chip Packaging.

-For a full detailed list, view our report.

Key Vendors:

-Advanced Semiconductor Engineering (ASE)

-Samsung Electronics

-STMicroelectronics

Other Prominent Vendors:

-3M Company

-IBM

-Micron Technology

-STATS ChipPAC

If you are interested in more information on the Global 3D IC Market 2014-2018 (http://www.technavio.com/report/global-3d-ic-market-2014-...), please contact our media team at media@technavio.com (mailto:media@technavio.com).

About TechNavio

TechNavio is a leading global technology research and advisory company. Founded in 2003, TechNavio has about 200 analysts globally and develops over 2000 pieces of research every year. We cover more than 500 technologies across 80 countries.

We focus on emerging trends that can shape a market, and model these trends using a mix of quantitative and qualitative tools in our proprietary research methodologies in order to build forecasts across market segments and geographies. These forecasts and analysis are used to help our customers identify new and existing opportunities in their markets. We also help customers assess their competitive position in a constantly changing technology market scenario.

TechNavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Our analysts obtain the information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, re-sellers, and end-users.

Our large and growing base of happy customers include technology suppliers, end users, consulting companies, investment firms, research institutes and media worldwide.

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Tags:Integrated Circuits, ic, Semiconductors, 3d, Market Research
Industry:Semiconductors, Technology
Location:London City - London, Greater - England
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