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| NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing in ShenzhenNEPCON ASIA 2025 in Shenzhen (Oct 28–30) gathers 3500+ companies with 80 forums on smart manufacturing, AI, robotics, and semiconductors, connecting global manufacturers in cutting-edge innovation.
By: RX Global In the context of an Electronics Manufacturing Services market that reached USD 609.79 billion in 2024 and is projected to grow to USD 648.1 billion in 2025—with forecasts suggesting it may surpass USD 1 trillion by 2032—NEPCON ASIA 2025 is poised to reflect the momentum and growth of the industry. Over 600 leading suppliers from diverse sectors, including PCB assembly, smart factories, semiconductor packaging and testing, automotive electronics, and touch display solutions, will demonstrate innovative products and breakthrough manufacturing processes. Complementing the main exhibition, the S-Factory Expo will focus on the integration of AI in smart factories and automation, with renowned industry names such as FANUC, Elite Robot, Flexiv, and experts from Fudan University offering in-depth insights into AI applications that enhance operational efficiency and product quality. Additionally, the Vision China Shenzhen segment will explore the convergence of machine vision and AI. This showcase will feature the latest innovative products and host the Vision + AI High-Quality Development Innovation Conference, addressing the evolving landscape in electronics, new energy, industrial automation, and more. NEPCON ASIA 2025 further distinguishes itself with dedicated segments that demonstrate emerging technological trends. Areas focused on embodied intelligence will present dissections of robot controllers, sensors, actuators, and power modules from leading brands. An AI smart glasses area will unveil 25 new devices from top-tier companies such as Huawei, Xiaomi, Meta, and Lenovo, exemplifying the leaps in interactive technology. A live demonstration of over 50 semiconductor packaging and testing processes will provide attendees with a window into advanced R&D and process optimization, while the automated packaging segment will highlight flexible manufacturing solutions and intelligent conveyance systems. The event will also feature 40 high-level forums that address trends and challenges across automotive electronics, semiconductors, AI, and cutting-edge smart technologies, fostering a collaborative dialogue among industry experts. Moreover, NEPCON ASIA 2025 will facilitate international collaboration through factory tours, country-specific networking events, and strategic matchmaking sessions designed to connect Chinese manufacturers with global stakeholders. For more information about NEPCON ASIA 2025 and registration details, please visit the official event website at https://www.nepconasia.com/ End
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