Base board test assessment method

Aug. 14, 2011 - PRLog -- Base board test evaluation methods in many publications all has the description. If Publication249 lEe, NEMA and ASTM (American material experiment society) standard mil- P-13949, 854584 (UK) and OIN40802 (Germany), etc. Usually, electrical and mechanical design and special processing technology requirements for the final material has some performance and controllable. Today the led aluminum plate manufacturer to introduce the two evaluation method of the substrate.
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1, resistant to solder testing
Electricity roadbed slabs of solder tolerated by a sample floating in 260 ℃ (500 and soil 3 ° F) S molten solder surface of a given time, usually lasts 10 to 60 S to determine. Sample must have and are processed with the printed circuit board on the same kind of copper angered and hole (without the plating or plated copper), sample can"t be flux treatment. In order to prevent be solder infiltrates, and a thin layer of silicon grease or oil is used to achieve this. To float in later, samples are visual check for foaming, halo, blaze wait for a phenomenon.

2, surface and appearance
Surface and appearance of the testing standards may is the most difficult of the full summary. The led copper substrate, usually because copper surface concave dot the anchor and dent and scrap, most of the system board business advocate surface and appearance standards used only in the finished the board, some of the substrate user"s copper foil surface only in some key areas standards, such as the plug in the edge of the area by the plugin. In those areas, users often give a key figure, the copper foil covered strict requirements for each business system board substrate key copper foil in the area before they are checked. It is used only in surface standards that already completed the board on the region. For more than 90% of the copper ultimately to be etching away, so sunken point or dent influence a slim chance of key areas.

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