Printed circuit board sink tin process features and operation instruction

Aug. 7, 2011 - PRLog -- 1. Bake at 155 ℃ 4 hours (equivalent to deposit a year), or via 8 days of high temperature (45 ℃, humidity test 93% relative humidity), or in the third time after reflow soldering still has good weldability;
2. Heavy tin layer smooth, level off, density, tin plating hard to form than copper of tin, wuxi must be mutual iodide;
3. Heavy tin layer thickness 0.8-1.5 u m, resistant to DuoCi lead-free soldering impact;
4. Solution stability, simple process, through analysis can be added and continuous use, need not change cylinder;
5. As much for vertical process is also applicable to the level process;
6. Heavy tin cost is far lower than the sink, and nickel gold hot air leveling quite;
7. For spray to the high density board tin short circuit has obvious technical advantage, apply to fine line high density of IC packaging and hard flexible board;
8. Apply to surface mount (SMT) or Press fit (Press-fit) installation process;
9. Lead-free sight, free from pollution to the environment, free recycling waste liquid.
PCB manufactory
www.raypcb.com
RayMing Technology (Overseas Department)
contact:LINDA
Tel: 0086-0755-27348087
Fax: 0086-0755-27389625
E-mail: sales05@raypcb.com
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1. The opening cylinder ingredients:

M401 acid with the exception of agents......... . 100 ml/L
Concentrated H2SO4............................ 50 ml/L
DI water............................... ... The rest

For use: the removal of the circuit board surface oil, oxide and fingerprints. In addition to the oil and the present market condition common all resistance welding ink are compatible.

2. The operation parameters:

Temperature: 30 to 40 ℃ best value: 35 ℃

Analysis: in addition to the frequency of agents once a day
Copper contain quantity once a day

Control system: with the exception of agents 80 120 ml/L best value: 100 ml/L
Copper containing less than 1.5 g/L amount

M401 increased by 1% for filling: content should be added 10 ml/L

A filter: 20 mu filter continuous filtration, change the crock change filter.

Life of copper content more than life: 1.5 g/L or every litres of capacity to 500 feet.

Four, Microetch micro erosion:

1. The opening cylinder ingredients:

Na2S2O4......................... . 120 g/L
H2SO4............................ 40 ml/L
DI water............................ The rest.

Program: (1) in a VAT of 85% to infuse water; DI
(2) add a good chemical calculation, stay pure H2SO4 cooling to room temperature;
(3) to join calculation and stir until all the good Na2S2O4 dissolved;
(4) to standard for DI water position.

2. The operation parameters:

Temperature: room temperature can

Analysis: H2S04 frequency shift once
Copper contain quantity once a day
The corrosion rate once a day

Control system: copper content less than 50 g/L

The corrosion rate of 30 to 50 mu, best value: 40 mu

Fill each Na2S2O4 filling: add 10 g/L, increase the content of 1%
H2SO4 every add 4 ml/L, increase the content of 1%

Life of life: copper content more than 50 g/L dilution to 15 g/when L,
And Na2S2O4 and H2SO4 added

Five, Predip the leaching:

1. The opening cylinder: 10% M901 the immersion; The rest: DI water

Use: in the sink before the corrosion out wet tin copper surface, this advance bobr on any resistance welding ink are not aggressive;

2. The operation parameters:

Temperature: at room temperature

Analysis of frequency: acid equivalent once a day
Copper contain quantity once a week

Fill filling: acid equivalent every add 100 ml/LM901, increased 0.1 equivalent
Source from PCB manufacturer: http://www.raypcb.com  
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RayMing PCB - www.raypcb.com . RayMing Technology (HK) Co., Ltd is a professional High-tech PCB Manufacturer of single-sided, double-sided and multilayer printed circuit boards(up to 20L), and some high end boards,