Uneven thickness of the second copper film treatment causes and folders

Sept. 30, 2010 - PRLog -- RayMing PCB - www.raypcb.com

Second, the thickness of the second inequality is a natural phenomenon of copper, because copper during the second exposure to the copper surface itself is uneven, so the local current density is also very different, the greater the difference, the more likely non-uniform thickness, the general solution is reduce the current density, which can be some improvement, followed by plating tank design and the design of the internal partitions are modified to improve the uniformity of the space, the real problem is a complex analysis to be based on the actual situation, not a few words to clearly describe the , which circuit board design also has a great influence, the line area of distribution will be uniform thickness of copper plating number, generally you can find an experienced supplier and you to do to improve, the issue mainly from the film clip in the plating uneven thickness, causing some or all of the above coating film, you might consider using thick dry film or find a solution to the membrane to provide a special liquid, which may have ruled out the difficulties of your film clip, which is simply the process control so that uniform coating.

Also, what is the second of copper? PCB plating processing is generally divided into two plating, once the entire board PTH plating is copper on the production line yet. This is called a bronze, also known as the entire board plating. Copper Copper is a second post-production later, a circuit once again the image of copper and tin plating process. Also known as pattern plating. This PCB plant in Taiwan, some of the normal process, and some PCB factory using DES is directly after the PTH copper plating production line and then thicken again once DES corrosion forming.
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