Organic solderability preservative coating OSP Application Process

Sept. 30, 2010 - PRLog -- RayMing PCB - www.raypcb.com

Organic solderability preservative coating OSP Application Process
With the light of electronic products, thin, short, small, multi-functional direction, toward the high-precision printed circuit boards, thin, multi-layered, small hole in the direction of development, especially the rapid development of SMT , so that the use of high-density SMT sheet (such as IC cards, mobile phones, notebook computers, tuner, etc. PCB) have been developed, making the hot air leveling process more suited to those requirements. OSP process is based on chemical methods, in the bare copper surface layer of film. This membrane has the oxidation, thermal shock, moisture resistance, and therefore, in the PCB manufacturing industry, OSP HASL alternative process technology. OSP technology, the PCB board level than the hot plate technology, the PCB has more excellent flatness and warping, but also to adapt to the electronics industry in the development of SMT technology requirements. Flux of organic pre-coating process is simple, competitive prices, and retaining solderability of copper are subjected to two or three times to meet the PCB soldering heat test. As a result, organic solderability preservative coating (or the flux of organic pre-) production line with the industry"s favor by the PCB. OSP technology is being developed rapidly.

1, process:

    Degreasing -> two wash -> Micro Eclipse -> two wash -> acid -> DI wash -> dry film -> DI water washing -> Dry

1, degreasing

    Degreasing effect of the direct impact to the film quality. Degreasing bad, the film thickness uniform. On the one hand, by analyzing the solution, the concentration of control within the process. On the other hand, we must always check the degreasing effect is good, if not good degreasing effect, it should be replaced except oil.

2, micro-pitting

The purpose of the formation of micro-etching of copper surface rough, easy to film. Micro-etching film thickness directly affects the rate, therefore, to form a stable film thickness, to maintain the stability of micro-erosion thickness is very important. Generally the thickness of micro-erosion control in 1.0-1.5um more appropriate. Class pre-production, micro-loss rate can be determined, according to micro-etch rate to determine the micro-etching time.

3, film

Washed before the film is best taken with DI water, to prevent the contaminated liquid film. Also the best film taken after washing with DI water, and the PH value should be controlled at between 4.0-7.0 to prevent pollution and damage to the film was.

   a, the effective working solution concentration on deposition rate have some influence, try to control the effective concentration of working solution stability is important.

   b, control the PH value of the stability of the (PH3.0-3.2). PH value of the rate of change on a larger film. The higher the PH value, the greater the deposition rate, PH value is lower, the deposition rate more slowly.

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