Process of Multilayer Hole

Sept. 30, 2010 - PRLog -- RayMing PCB - www.raypcb.com


Process of Multilayer Hole
I. Introduction

As we all know, Hole plywood production process is the most critical aspect of the intrinsic quality of her relationship to the multilayer good or bad. Hole drilling process is divided into to two copper pollution and chemical processes. Outer layer of electroless copper is the internal circuit interconnect process; to the role of pollution is to remove the drilling drilling process because of high temperature epoxy resin resulting from drilling pollution (particularly in the copper ring on the drill sewage), to ensure that chemical Shen copper after the high reliability of electrical connection.

Second, the Hole

Multilayer technology sub-etching process and non-etching process. Etching process at the same time remove the epoxy resin and glass fibers to form a reliable three-dimensional integration; non-etching process to remove drilling just off the process of drilling and epoxy vaporization pollution, to clean the hole wall, with the formation of two-dimensional single theory, three-dimensional than two-dimensional combination with high reliability, but the electroless copper layer by increasing the density and scalability, can reach the appropriate technical requirements. Non-etching process is simple, reliable, and has been very mature, so most manufacturers are widely used. Potassium permanganate to drill pollution is a typical non-etching process.

Process

Epoxy countercurrent rinsing → swelling → secondary sewage → potassium permanganate to drill in the second counter-current washing and reduction → → rinsing → Adjustments → secondary countercurrent countercurrent rinsing → coarsening two secondary counter-current rinsing → → → ion prepreg Palladium II upstream activation → washing → rinsing → reduction → → secondary electroless copper impregnated acid reflux → rinsing → Pre-plating

Principle and control technology

Swelling

Objective: swelling of epoxy resin, to soften, as potassium permanganate to prepare for drilling pollution.

Formula

Name matching the temperature time
NaOH 20g / l 60-80 ℃ 5min
Glycol ether has 30g / l
Has been diol 2g / l
The remaining water

     Epoxy compound is a high-poly shape, with excellent corrosion resistance. The dissolution of the main form of corrosion, swelling and chemical cleavage (such as: epoxy resin is mainly concentrated sulfuric acid dissolution, the etching effect is very clear.) According to "like dissolves like" the experience of law, ethers, polar organic compounds generally weak, and there with a similar molecular structure of epoxy resin (RO-R "), so there is some solubility of epoxy resin. Because ether can hydrogen bond association with water, so have some solubility in water. Therefore, the commonly used water-soluble organic ether to drill dirt as swelling agent. Swelling solution of sodium hydroxide content can not be too high, otherwise, would undermine the hydrogen bond association, the separation of the organic chain. In production, used herein to analyze the swelling agent content.

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