Evolving High-Speed Mezzanine Connectors REPORT CONDUCTED BY Aarkstore Enterprise

June 26, 2009 - PRLog -- This new report providing a complete analysis of evolving high-speed mezzanine connectors. Current connector market values and forecasts are provided by bandwidth, region of the world, and end user market for the years 2007, 2008, 2009, and 2013.
 Mezzanine architecture offers significant packaging advantages. System density has become a critical issue for circuit designers and can be increased by utilizing the space between daughtercards. Products can be effectively partitioned to provide pluggable modules simplifying repair, customization and upgrading. Printed circuit board routing issues can be simplified and layer count reduced by spreading functions over larger board surface areas.
 A new chapter focused on innovation provides examples of creative approaches to addressing some of the challenges associated with interconnection and packaging of next generation electronic equipment.
 This market research report also includes several tutorial chapters on connector and high-speed design issues that enable a non-technical reader to gain from the information provided.
   Connector manufacturers who have developed expertise in the design and manufacturer of high-speed connectors as well as established extensive engineering support service departments have resulted in a stratified market of industry leaders and those who may not be able to replicate these advanced interfaces.
Designing 6+ Gb/s channels is not a trivial issue, causing many engineers to rely on their chosen connector vendor to provide extensive product selection and design support 24/7 on a global basis. Many of these new interfaces are benefiting from better understanding of the behavior of high-speed signals resulting in the refinement of the connector and its PCB launch.
 Time domain test methods are being supplemented with frequency domain S-parameter data to quantify the signal integrity of a channel.
 The need for increased system packaging density has become a critical design objective. Connector manufacturers are finding ways to design new mezzanine connectors with contact pitch as close as 0.4mm with the ability to conduct multi-gigabit signals.
 Connector Market
 Design engineers often prefer to utilize one interconnect system throughout the product. Connector manufacturers have responded with complete interconnect families that often include backplane, mezzanine and related cables. Designers are able to understand the quirks of one connector type and develop a close working relationship with a single supplier.
Commitment to a single interconnect family can present problems in insuring adequate supply and market prices. Manufacturers of backplane connectors have been establishing cross-licensing agreements to address this concern. Sole sourcing has traditionally been less of a concern for mezzanine connectors, but recent agreements on dual sourcing of the Samtec SeaRay, Hirose IT-3, and Tyco Electronics STRADA Mesa connectors may portend a new direction.
The market has stratified with a select group of highly competitive connector suppliers offering a full range of state-of-the-art interconnects. A secondary tier of connector manufacturers are focused on supporting individual segments of the market that requires less technical resources and / or may offer a quicker return on investment.
Formal standards organizations as well as special interest groups are developing a large number of specifications that define specific mezzanine connectors. Many of these new standards have been introduced to support high-speed serial signaling. There are advantages and challenges associated with proliferation of overlapping specifications.
Mezzanine connectors tend to introduce less high-speed signal distortion than backplane connectors making their design somewhat easier for second tier connector suppliers to enter the market.
The current global economic recession has raised some serious questions about the adoption rate of new high-speed mezzanine connectors. Leading connector manufacturers are actively designing and introducing new mezzanine connectors in anticipation of future market growth as well as well as achieving recognition of industry leadership.
 This market research report is the fourth in a continuing series of investigations of this highly dynamic product segment. The advancement of this technology together with experience gained in designing these unique interfaces may set the stage for the evolution of all types of next generation electronic connectors. Those suppliers who have consistently made the necessary investment in resources to develop this expertise may emerge as the only viable suppliers capable of supporting future application requirements.
The preceding topics are just a sampling of the information and detailed data provided in this new report.
Chapter 1 Report Scope and Methodology
Report objectives
Study methodology|
Data collection forms
Connector manufacturer survey
Connector user survey
Chapter 2 Introduction
Preface
Introduction
Chapter 3 High Speed Connector Basics
Common backplane architecture
Mezzanine card architecture
High-speed transmission line issues
Defining features of high-speed mezzanine connectors
Mezzanine connector selection criteria
Bandwidth rating of connectors
Performance measurements tools
Test and analysis equipment
Comparison of electrical performance
Design support provided by connector manufacturers
Chapter 4 The Need for Speed
Market drivers to higher speed interfaces
Speed vs. density
The influence of industry standards
Chapter 5 High Speed Interconnect System Elements
 Driver and receiver technology
Printed circuit board materials
Printed circuit board design and fabrication
Chapter 6 High-Speed Connector And Market Trends 2006-2008
Key market trends
High-speed mezzanine family source chart
Chapter 7 High-Speed Mezzanine Connectors
Mezzanine connector architecture
Advantages of mezzanine packaging
Interface types
Mezzanine connector applications
Platform reference designs
Chapter 8 Overview Of Current High-Speed Mezzanine Connectors
Advanced Interconnections Corp. / Emulation Technology Inc.
Amphenol TCS – VHDM Stacker, XCede Stacker, NexLev
ERNI Components – MicroSpeed, MicroSpeed Blindmate,
MicroSpeed Power modules, ERmet Zd Stacker, Right-Angle PCI
Express connector
FCI – MEG-Array, GIG-Array, AirMax VS Stacker, TwinMezz
Fujitsu – FCN-260 BTB Series
Harting – Micro Card Edge Connector
Hirose – IT-1, IT-2, IT-3
Molex – Plateau HS Mezz, HD Mezz, SEARAY, VHDM Stacker
Samtec – Q-Series, EdgeRate, DP Array, IsoRate, SEARAY,
RAZOR Beam, RU8 Series
Tyco Electronics – Mictor, Step-Z, Multi-Gig RT StackerSTRADA-Mesa
Yamaichi Electronics USA – CNO99Series  AMC Connectors
Chapter 9 Mezzanine Connector Design Feature ChartsIntroduction
Amphenol TCS – NexLev
ERNI – MicroSpeed
FCI – Meg-Array
FCI – Gig-Array
Fujitsu – FCN260
HARTING – Micro-Card Edge Mezzanine
Hirose – IT-2 Series
Hirose – IT-3 Series
Molex – Plateau H.S. Mezz
Molex – HD Mezz
Samtec – Q Series
Samtec – EdgeRate
Samtec – SEARAY
Samtec – RU-8.
Samtec – RAZOR Beam (SS4/ST4)
Samtec – RAZOR Beam (LSS)
Tyco Electronics –Mictor
Tyco Electronics – STRADA-Mesa
Yamaichi – CNO99
Chapter 10 Market Analysis / Forecasts
Measurement criteria
High Speed Mezzanine Connectors
World market 2007 -2013 by bandwidth segment
World market 2007 -2013 by geographic region
World market 2007 -2013 by end user
Chapter 11 High-Speed Connector Innovation
Introduction
PCB attachment
Techniz G-Flex
Verdant Electronics
TPL Group
Silicon Pipe
CHE-YU LI & Company
Paricon Technologies
 Chapter 12 Major Findings And Conclusions

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