MVP adds Major Inspection Capabilities at IPC Apex Expo 2023 in San Diego

VISTA, Calif. - Jan. 18, 2023 - PRLog -- MVP will demonstrate its latest ground-breaking software release containing major new inspection capabilities for inspection and metrology across a broad range of MicroElectronic, Semiconductor, and SMT applications. For Microelectronics inspection, MVP will be demonstrating both Hybrid/MCM Style Wirebond and RF product inspections. A preview of our latest AI/Deep Learning integration will also feature. We look forward to discussing your inspection requirements at our booth at the forthcoming IPC Apex show.

MVP continues to be a leader of AOI innovation, applicable to the most complex inspection challenges. With inspection platforms for Microelectronics, Semiconductor and SMT, MVP continue to be versatile and adaptable for multiple inspection challenges and material handling formats.

In anticipation of the show Dr George T. Ayoub, President of MVP said

"The newly released 8.1 software elevates the AOI inspection experience to new levels. In effect, with 8.1 software release, MVP has added major inspection capabilities to its extensive toolbox. Among other notable innovations in this release, MVP has revamped all of its algorithms, enhancing them with new power and fusing them all into one common framework with a unified interactive user interface that is completely graphical (GTilt). As a result, the benefits to the user are ease of tuning, ease of learning and improved performance across the board for all applications. In addition, the program generation has been enhanced and streamlined to quickly and easily generate recipes programs in a step-by-step guided approach.

MVP is also demonstrating a preliminary version of its 8.3 software highlighting a brand-new, friendly user interface for the operator and programmer. 8.3 software will also showcase Artificial Intelligence (Deep Learning) module that integrates seamlessly with Cognex's VisionPro Deep Learning software suite providing exceptional capabilities in AI when needed.

With these landmark releases of software, MVP strengthens its leadership position in the AOI market in general and in the wire bond market, metrology, and surface inspection markets in particular. We feel confident that the software additions will be well received by all customers."

For more information about the new capabilities, and to learn more about the applications on the systems beyond what is described here, please contact MVP directly by enquiring on its website www.visionpro.com/info or talking to any of its representatives in the show.

About MVP:

MVP develops industry-leading inspection equipment and services for the Microelectronic, Semiconductor and SMT industries. In collaboration with our global customers base, our team of engineers have continued to advance the state-of-the-art and offer innovative solutions that have been applied across many customers and industries.

www.visionpro.com