Sinoguide is developing new high performance thermal interface materials

SHENZHEN, China - Dec. 22, 2016 - PRLog -- For the microelectronics field, the military and private sectors alike need solutions to technologic challenges. Sinoguide Technology R&D technical manager Mr.Steve is developing high performance thermal interface materials (TIMs) that have a superior ability to transfer heat and a strong capacity to keep cool.

When evaluating the central processing unit for example, there are many sectors require temperature management. "As the electronic devices become smaller and more compact, the heat generating source is becoming higher per unit area. In another word, it would bring higher temperatures and you require better thermal interface materials for thermal transfer. This is crucial for radars,laser systems and also for military electronics," said Mr Steve.

Essentially and most importantly, the device needs the capability to avoid overheating. As Mr Steve claims, "The device would fail unless you cool it down."

During the assessment for an electronic device and a cooling system that need to be placed together as operation, if there is no application of thermal interface material in between, the heat created by the electronic device can potentially destroy the device. According to Mr Steve suggestions, non-soft materials are considered less effective comparing with thermal interface materials(TIMs) because they do not adequately cover all interior air voids and gaps.

Mr.Steve now is developing a new high performance thermal interface material at separately 8w/mk and 11 m/k for the high power market application.

Learn more about SinoGuide Technology http://www.sg-thermal.com