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Follow on Google News | Introducing 3M™ Foam Lamination Tapes Available NOW at Tekra!*Level 1 - Temperature resistance: 200F - Substrates to bond to: PU ether, PU ester, cross-linked PE foam and microcellular urethane. *Level 2 - Temperature resistance: 225F - Substrates to bond to: PU ether, PU ester, cross-linked PE foam, EPDM foam, neoprene foam, nitrile foam and microcellular urethane. *Level 3 - Temperature resistance: 275F - Substrates to bond to: Santoprene, neoprene rubber, butyl rubber, and many versions of EPDM rubber. Tekra will be supporting 3M's new line of 3M™ Foam Lamination Tapes providing the ability to purchase the products in smaller minimums on the most popular selling tapes in the portfolio. Tekra can also custom slit 3M™ Foam Lamination Tapes to desired sizes. Call us today at 1-800-448-3572 or email us at orderscentral@ End
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