Modius® and Emerson Collaborate to Provide an Integrated Internet of Things (IoT) Solution
Integrated Offering Helps Companies Optimize and Increase the Security, Availability and Efficiency of Critical Facility Resources
By: Modius, Inc.
This integration will enable customers to quickly and easily deploy environmental sensors in any facility and instantly collect real-time monitoring data, and provide intelligent alerts and alarms for issues with the power and cooling infrastructure. The real-time environmental data collected from the TOD Wireless sensors by the OpenData Software provides the information to make informed decisions for energy optimization initiatives, and alerts facility managers to environmental issues before they lead to unplanned equipment downtime. Strategic collaboration activities provided the technical integration, coordinated marketing, sales and services support for this “plug and play” offering.
According to Gartner, in their research on the ‘Top 10 Strategic Predictions for 2015 and Beyond: Digital Business is Driving ‘Big Change’, dated October 2014, “By 2018, the total cost of ownership for business operations will be reduced by 30% through smart machines and industrialized services.” By using Modius’ OpenData monitoring platform and Emerson’s Smart Wireless Sensor networks, real-time information from the environmental sensor network, this turn-key IoT solution can be used to derive substantial savings from resource optimization and reduced labor costs. The combined solution provides customers with the following benefits:
• Reduced unplanned downtime and its associated costs
• Improved response time to critical events with intelligent escalation
• Real-time and historical reporting of power and cooling loads
• Superior capacity planning and cost allocations based on real data
• An easy to install, configure, maintain and expand system
This Modius-Emerson joint solution allows customers to easily collect detailed operational-
“There is a massive push in the industry today to improve the capacity and efficiencies of facilities and their supporting infrastructure,”
“This joint solution has the opportunity to change the way IT and facility support organizations plan, think, and react,” said Craig Compiano, CEO of Modius. “Customers have previously been challenged to cost effectively improve operational efficiencies in their facilities. By combining Modius and Emerson technologies in an affordable joint offering, now even the smallest organizations can leverage this data from the Internet of Things to drive operational improvements and eliminate unplanned downtime caused by environmental problems or insufficient capacity.”
Learn more by visiting the Modius website at www.modius.com.
Modius, Inc. is a leading provider of management information systems for optimizing data center and facility infrastructure and operations. Modius develops and commercializes real-time monitoring and analytic solutions that enable unified visibility and better control over the critical systems in the data center, including power, cooling, and space. The company’s mission is to simplify the operations of increasingly diverse and complex facilities and IT environments, while markedly improving performance efficiencies. Founded in 2004 with headquarters in San Francisco, CA, Modius has customer deployments in the Americas and Internationally. For more information, visit http://www.modius.com or call (888) 323-0066.
Emerson , based in St. Louis, Missouri (USA), is a global leader in bringing technology and engineering together to provide innovative solutions for customers in industrial, commercial, and consumer markets around the world. The company is comprised of five business segments: Process Management, Industrial Automation, Network Power, Climate Technologies, and Commercial & Residential Solutions. Sales in fiscal 2013 were $24.7 billion. For more information, visit www.Emerson.com.
Therm-O-Disc, part of Emerson Climate Technologies, is a leader in the design and manufacturer of sensors and controls for multiple industrial and consumer industries. The company's product line includes a broad range of specialized sensing capabilities, including bimetal and NTC temperature, differential pressure, relative humidity, thermal cutoffs, and wireless communications. Therm-O-Disc is headquartered in Mansfield, Ohio. For more information, visit www.tod.com.