ESD Testing and Latch-up Testing Services
Electrostatic Discharge (ESD) Testing: HBM, MM, & CDM (socket & non-socket). Latch-up Testing, and Transmission Line Pulse Testing. Triboelectric charge accumulation testing. Testing Standards: MIL-STD, JEDEC, ESDA, AEC and IEC.
By: Materials Analysis Technology Inc. Taiwan
MA-tek provides various ESD testing services such as HBM, MM, socket CDM, non-socket CDM, latch-up testing, and TLP testing services. ESD Testing for upto 768 pin IC, and devices with all types of packages.
Latest service item is 'Triboelectric charge accumulation testing' (ESD AVD11.2-1995)
Tests can be performed both in room-temperature and high-temperature testing modes. We provide different types of IC sockets for ESD/Latch-up testing [Ref. MA-tek socket list]. Furthermore, we offer IC packaging services (Au/Al wire bonding, die mount, epoxy, encapsulation)
Service Locations for all ESD Tests:
(1) MA-tek Inc, Jinshan Lab, Hsinchu Science Park (ESD and Reliability Testing)
(2) MA-tek Inc, Jubei Lab, Tai-Yuan Science Park (ESD Testing, Failure Analysis, FIB
(3) MA-tek Inc, Shanghai Lab, Zhangjiang Hi-tech Park (ESD Testing, Materials & Failure
(4) MA-tek Inc. Japan Office (Osaka Sales Office)
MA-tek also provides a wide range of ESD-related services:
Customized ESD/Latch-up free IC circuit design from generic concept to circuit layout
Robust I/O cell libraries
ESD/Latch-up design rule establishment
ESD training support and consulting services
Total solution failure analysis
Board-level CDM consulting
System-level ESD consulting
Class 0, ESD free, manufacturing environment auditing.
Human Body Model (HBM)
It is relatively easy to generate considerable charge and potential, by walking on carpeting or hard floors. When a charged person touched a conductive path of an IC package or circuit board, the body charge is either shared with the device or discharges through the device to ground. The discharge is rapid, in a few hundreds nano-seconds (ns), and is frequently causing damage or failure of the device.
A charged person touched a conductive path of an IC package, the body charge is either shared with the device or discharges through the device to ground.
The most frequently used test standards for HBM include: MIL-STD-883G method 3015.7, EIA/JEDEC JESD22-A114E, ESDA STM5.1-2001. HBM is modeled by a 100pF capacitor discharged through a switching component and 1,500 ohm series resistor into the component.
Machine Model (MM) is proposed for automated assembly and manufacturing environment. When a machine with accumulated charges touched a conductive path of an IC package or circuit board, the charges are either shared with the device or discharges through the device to ground.
The most frequently used test standards for MM include: EIA/JEDEC JESD22-A115A and ESDA STM5.2-1999. MM is modeled by a 200pF capacitor discharged directly into a component with no series resistor. The discharge occurs from a few to tens of ns during which the current levels can reach several amperes.
Charged Device Model
IC components can be charged in various ways. If the component touches a metallic surface while it is charged, a very rapid discharge occurs in a few ns during which the current levels can reach several tens of amperes.
The most frequently used test standards for CDM (non-socket CDM) include: EIA/JEDEC JESD22-C101C and ESDA STM5.3.1-1999. This procedure for SDM is still a work in process and has had to overcome a number of limitations including too great a dependency on the specific design of the SDM tester. A draft document, DSP5.3.2-2003 Draft, was published in 2003.
System- Level ESD test with IEC-61000-4-
This international standard defined by IEC (International Electrotechnical Commission) relates to the immunity requirements and test methods for electrical and electronic equipment subjected to static electricity discharges, from operators directly, and to adjacent object. In addition, it includes electrostatic discharges which may occur from personnel to objects near vital equipment.
The test can be performed in the following manner:
(a) Air Discharge Method: Air discharge at insulating surfaces of the EUT (equipment under test). The charged electrode of the test generator is brought close to the EUT, and the discharge actuated by a spark to the EUT.
(b) Contact Discharge method: Contact discharge to the conductive surfaces of the EUT. The electrode of the test generator is held in contact with the EUT, and the discharge actuated by the discharge switch within the generator.
(c) Discharge to Horizontal Coupling Plane (HCP) and Vertical Coupling Plane (VCP): Discharges to objects placed or installed near the EUT are simulated by applying the discharges of the ESD generator to a coupling plane, in the contact discharge mode.
Transmission Line Pulse (TLP)
In-depth characterization of current conduction and voltage within ESD protection structures under influence of ESD events. Getting the ESD design right at the first time and shortening the product development time. Reproducing failure mechanism and electrical behavior of a device in response to a HBM ESD pulse.
Triboelectric charge accumulation testing:
ESD testing is performed to evaluate anti-static properties of ESD-proof mats and storage-transportation boxes etc. Inclined plane test method is used in accordance with ESD AVD11.2-1995. Our ESD meter has resolution of +/- 1 Volt.