Metal plate board surface blistering Causes and Countermeasures

In electroless copper steps, we will focus on the reduction and copper processes. According to replace the bath before the treatment effect, to the oil and activation are good, coarsening is not much relation with this phenomenon
By: RayMing PCB - Raypcb.com
 
Sept. 30, 2010 - PRLog -- RayMing PCB - www.raypcb.com

Metal plate board surface blistering Causes and Countermeasures
This article describes one case of holes on the surface of metal plate board analysis of the causes of blistering and to analyze all sorts of solutions. Ultimately determine the cause of Hole plate board surface causes blistering.

Phenomenon:

Once, after the replacement of copper trough bath, double panel after plating by the full board plating thick copper plate surface blistering was found, accompanied by nodulation. Foaming at irregular in shape, with the visual shape of the natural flow of a liquid similar to leave marks, and every bubble is the point of beginning.

Analysis:

Hole in the typical process is: electroless copper (to oil - washing - coarse - washing - Acid prepreg - activation - washing - Reduction (1) - Reduction (2) - copper), thick copper plating the entire board (water spray - Acid prepreg - plating the entire board - washed - passive - wash - dry).

Under the direct negation of the failure process generated in the plating steps, because the plating process is simple, if they have this phenomenon, then the process is the only full-board electroplating, plating tank that is the introduction of organic impurities. However, sharing the graphics plating copper plating bath but no any problem, and thus determine the cause of the electroless copper Section.

In electroless copper steps, we will focus on the reduction and copper processes. According to replace the bath before the treatment effect, to the oil and activation are good, coarsening is not much relation with this phenomenon, but these have not replaced the bath tank.

Bubble shape analysis based on that: This is caused by a still liquid, because the copper solution prepared in strict accordance with the parameters of vendor implementation, but also just prepared stock solution and reducing agent in this phenomenon may lead to the introduction of impurities. Reducing agent component is not clear, only knew a concentrated liquid. Not washed after the restore, direct electroless copper, which makes copper impurities into the tank as possible.

Solution:


RayMing PCB - http://www.raypcb.com

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RayMing PCB - www.raypcb.com . RayMing Technology (HK) Co., Ltd is a professional High-tech PCB Manufacturer of single-sided, double-sided and multilayer printed circuit boards(up to 20L), and some high end boards,
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