Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability

Aug. 16, 2010 - PRLog -- Thermally Conductive,
Low Viscosity Epoxy Features
Cryogenic Serviceability

HACKENSACK, NJ – Aug 12, 2010 – Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.

EP30FLAO features a wide service temperature range of 4K to 250ºF. Its thermal conductivity is 9-10 BTU/in/ft²/hr/ºF. The viscosity of the mixed compound is 5,000 to 6,000 cps at 75ºF. In addition to these attractive attributes, it has a low thermal expansion coefficient, superior dimensional stability, good physical strength and toughness.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.

Master Bond’s Cryogenically Serviceable Epoxies

Master Bond’s EP30FLAO is a versatile, two component epoxy system for demanding thermal management applications at cryogenic temperatures. Read more about Master Bond’s cryogenic epoxy formulations at http://www.masterbond.com/lp/tabs/tp_pp_cryogenic.html, or contact Master Bond’s Technical Support Team by phone at +1-201-343-8983, by fax at +1-201-343-2132 or by e-mail at techinfo@masterbond.com.



CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132

MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com

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Master Bond manufactures custom formulated adhesives, sealants, coating, potting compounds, and encapsulants for applications in electronic, medical, optical, aerospace, and other hi-tech industries.