Adeia Presents Technical Papers and Exhibits its Hybrid Bonding Technology at the 2024 Electronic Components and Technology Conference

By: Adeia
 
Igniting Innovation
Igniting Innovation
SAN JOSE, Calif. - May 28, 2024 - PRLog -- Adeia Inc., the company whose patented innovations enhance billions of devices, will share the latest developments in hybrid bonding technology during the premier advanced packaging conference, Electronic Components and Technology Conference (ECTC) at the Gaylord Rockies Resort and Convention Center in Denver, Colorado from May 28 to May 31, 2024.

The Adeia team will be on hand at booth #633 throughout the ECTC event to discuss the performance enhancement that hybrid bonding technology brings to 3D NAND, high bandwidth memory and chiplet integration and CMOS image sensor stacking.

Adeia experts will present papers during two technical sessions that will demonstrate new metrology techniques to improve assembly throughput and increase device yield of hybrid bond interconnect technology for manufacturing, as the industry is embracing this technology.
  • Session 12: Artificial Intelligence and Advanced Modeling Approaches
    • Title: Deep Convolution Neural Networks for Automatic Detection of Defects Which Impact Hybrid Bonding Yield
    • Time: 3:45 p.m. MT on Wednesday, May 29
    • Authors: Drs. Oliver Zhao, Dominik Suwito, Bongsub Lee, Thomas Workman, Laura Mirkarimi

  • Session 23: Novel Bonding Technology for Advanced Assembly Substrates and Integration
    • Title: High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry
    • Time: 4:45 p.m. MT on Thursday, May 30
    • Authors: Drs. Bongsub Lee, Oliver Zhao, Arianna Avell├ín, Suhail Sadiq, Gill Fountain, Dominik Suwito, Guilian Gao, Laura Mirkarimi
"The most advanced monolithic chips are challenged by the rising demand for compute performance as advanced node scaling is stalling. Hybrid bonding technology offers an intelligent solution enabling high bandwidth, low latency, low power interfaces between logic and memory, all important for massively parallel computation in artificial intelligence workflows," explains Dr. Laura Mirkarimi, senior vice president, engineering, at Adeia.

These systems rely on components like graphics/compute/tensor/processing units (GPUs/ CPUs/TPUs) with high-bandwidth memory (HBM) which are co-located for high-speed connectivity. Throughout the sector, momentum is growing for hybrid bonding technology to be widely used in logic memory interfaces such as 3D NAND, HBM and processor devices.

"Hybrid bonding is a proven technology that offers high interconnect density with improved electrical and thermal performance, all while offering flexible supply chain management, time to market and cost reduction with heterogeneous integration compared to currently available alternatives," Mirkarimi said.

Members of the press interested in learning more about Adeia and its role in bringing hybrid bonding technology to market can reach out to the press contacts below for more information.

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About Adeia

Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia's fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia's IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit www.adeia.com.

For Information Contact:

Investor Relations
Chris Chaney
IR@adeia.com

Media Relations
JoAnn Yamani
press@adeia.com
+1.408.781.5719

Photo:
https://www.prlog.org/13022167/1
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