High IO Count BGA Reballing Preform Simplifies Repair
By: BEST Inc
BEST Inc. announces that it has begun shipping 6,000 ball count BGA preforms. BEST EZReball™ preforms are in their 8th year of production and until recently the largest ball count consisted of 4,000 solder balls on a 0.4mm pitch over a 45mm x 45mm package. This latest product capability was the result of advanced laser processing of the preforms.
BEST EZReball™ soldering preforms can be ordered and built in a variety of configurations from 6 to now 6,000 plus balls. Sizes of the balls range from 10 to 40 mils in solder alloys of Sn63Pb37, SAC305 and Sn10Pb90. Each of the preforms is "made to order" onsite at BEST Inc. using laser machining to construct the preforms. Lead times for a single pack of (15) preforms are typically a few business days.
BGA reballing preforms (http://www.soldertools.net/
"As the IO count for server and cloud-based computing get larger and more complex we are constantly being challenged to create greater ball count reballing preforms," commented Dan Patten, general manager at BEST Inc.
BEST Inc. also provides reballing services to a variety of Class 2 and Class 3 electronic electronic assemblers, OEMs and others.
About Business Electronics Soldering Technologies (BEST)
BEST is a supplier of PCB rework and repair services and soldering tools in the communications, computer, industrial, automotive, avionic and military sectors. Headquartered in Rolling Meadows, Illinois BEST is a master IPC-certified solder and wire harness training center certifying students and instructors in IPC-A-620, J-STD-001, IPC-A-610 and IPC 7711/21. Training takes place in Chicago, Minneapolis, Detroit, Cleveland and near Nashville, TN.