Printed Circuit Board X-Ray Inspection Webinar
This 2-part (2 x 90 min) webinar will instruct PCB assemblers, process engineers and buyers of printed circuit boards how to interpret x-ray images and the IPC acceptance criteria.
By: BEST Inc.
ROLLING MEADOWS, Ill. - Nov. 3, 2017 - PRLog -- BEST Inc., along with Nikon Imaging and the SMTA (Surface Mount Technical Association)
This webinar is intended for process engineers, QC inspectors and reliability engineers involved in both electronics and wire harness assembly.
This webinar series will have the following instructional goals:
· Understand the most important specifications in procuring a modern x-ray machine
· Understand how x-ray inspection is used to inspect a variety of electronic component body styles including leadless devices, area array devices, high density connectors, throughhole connections and standard SMT components
· Understand how x-ray inspection is used for inspection, defect analysis and troubleshooting
· Understand how industry standards tie in with the use of x-ray inspection
Kamran Iqbal, one of the instructors, is a product manager with Nikon Imagining having extensive applications experience within the semiconductor industry, device packaging, SMT, Manufacturing, test and inspection. Bob Wettermann is one of the technical trainers at BEST Inc. a contract PCB rework and repair facility with 20 years of electronics experience and he will be the co-instructor.
Interested parties can go to https://www.smta.org/