Telink Semiconductor and IXYS Corporation join forces to address IoT chip solutions market

SHANGHAI - June 20, 2016 - PRLog -- Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, and IXYS Corporation, a leading  manufacturer of power semiconductors, have signed an agreement to jointly target the growing IoT market.  The companies will initially address geographies such as Korea, Japan and Europe, leveraging IXYS' channels and sensor technologies, and Telink's unified IoT system-on-chip solutions.

Founded in 1983, IXYS Corporation  has been developing technology-driven products to improve power conversion efficiency, generate clean energy, improve automation and provide advanced products - and has over 3,500 customers  in the transportation, medical and telecom industries.  IXYS is a pioneer in the development of power semiconductors, integrated circuits and RF systems that effectively monitor electrical voltage to produce maximum effect with least expenditure of energy.

Telink Semiconductor is focused on IoT chipset solutions for smart homes, with a product portfolio that addresses all major communications protocols including Bluetooth Smart, ZigBee, 6LoWPAN/Thread and HomeKit. The company has a leading position in BLE (Bluetooth low energy) mesh based solutions, with annual sales of over 100 million RMB and major customers such as GE, Philips and Cisco.

Telink's CEO, Wenjun Sheng, said, "We are pleased to be working with IXYS. This partnership will allow us to extend the reach of networked small devices for the home and industrial markets, as well as strengthen IXYS's product portfolio."

Timothy Kwon, CEO of Radiopulse which is  a IXYS subsidiary company, added, "The huge growth in connected devices both now and forecast for the future puts significant challenges on device manufacturers for low cost, low power, and highly integrated chip solutions. Our position in the communicatons and power semiconductor markets combined with Telink's strength in the home automation market, and especially Bluetooth low energy, puts us in an excellent position for the IoT market."

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About Telink Semiconductor

Telink Semiconductor has developed a new generation of internet of things (IoT) devices. Its highly integrated low power radio frequency and mixed signal system-on-chip solutions address smart lighting, home automation, smart cities, remote controls, human interface devices, wearable devices, wireless toys, and many more consumer electronics applications which require support for multiple communications technologies in real time.

The current product portfolio from Telink includes low-power 2.4Ghz RF SoCs for Bluetooth Smart, ZigBee, 6LoWPAN/Thread, HomeKit and low-power high-precision analog ICs for resistive/capacitive/electromagnetic touch control, serving numerous markets. Telink Semiconductor is a fabless IC design company and was founded in 2010 with subsidiaries and offices in California, Shenzhen, Taiwan and Hong Kong. For more information, visit the Telink Semiconductor web site.

About IXYS Corporation

Since its founding, IXYS Corporation has been developing power semiconductors and mixed signal ICs to improve power conversion efficiency, generate solar and wind power and provide efficient motor control for industrial applications. IXYS and its subsidiary companies offer a diversified product base that addresses worldwide needs for power control in the growing cleantech industries, renewable energy markets, telecommunications, medical devices, transportation applications, flexible displays and RF power.  For more information visit the IXYS Corporation web site.