TSV Expected to Enter Mainstream for 3D Integration in 2013-14
Through-silicon via (TSV) technology is expected to enter the mainstream of the semiconductor industry in 2013-2014, according to a recent report by Linx Consulting, the premier electronic materials consultant to the semiconductor industry.
The report indicates that TSV is emerging as a method of 3D integration, especially for memory devices, embedded logic and heterogeneous applications. TSV offers designers more freedom and greater energy and space efficiencies than competing technologies such as wire bonding and flip chip stacking.
In addition, TSV addresses the data exchange issues of wire bonding, and offers several other advantages including:
· Shorter interconnects between the die, reducing power consumption caused by long horizontal wiring
· Eliminates the space and power wasted by buffers (repeaters that propel a signal through a lengthy circuit)
· Reduces electrical parasitics in the circuit (i.e., unintended electrical effects) that decrease device switching speeds
· Higher input/output density than wire bonding, which consumes much more space.
Linx Consulting is the leading electronic materials consulting firm, serving the semiconductor, photovoltaics, and electronics industries worldwide. The firm develops unique insights and creates knowledge at the intersection of advanced thin film processing and performance chemicals and materials.
To obtain more information about this report contact Mike Corbett at mcorbett@linx-