“ADVANCED PACKAGING : Polymeric Materials for 3DIC & WLP Applications” added to ReportBuyer.com

June 13, 2012 - PRLog -- New report: ADVANCED PACKAGING : Polymeric Materials for 3DIC & WLP Applications:  

ReportBuyer.com has added a new report http://www.reportbuyer.com/go/YOL00175
Summary of Report  -

The first complete report analyzing in detail the opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications

POLYMER USAGE WILL GROW BY 26% CAGR IN WAFER LEVEL APPLICATIONS OVER 5 YEARS

Polymeric semiconductor material market reached a value of $274M last year and its growth over the next 5 years of more than 26% CAGR will be fueled by the expansion of flip-chip wafer bumping, Fan-in WLCSP packages, 3D WLP, FO WLP packages, 2.5D Glass / Silicon interposers and 3DIC packages.
Yole analysts have gathered market data, technology information and analysis necessary to answer the following questions:

What materials are being used in what applications ?
What key properties do I need to understand before I make a material choice ?
Who are the key supplies of these materials and what is their market share?
What synergies do competitors have in their product lines ?

AN INCREASING NUMBER OF POLYMERS ARE USED FOR WLP APPLICATIONS
About half of the demand today for polymeric materials in 3DIC & WLP applications is driven by dielectric passivation resins which reached about $107M market value in 2011.
Polymide (PI) and BCB of DOW Chemical still account for > 70% of the total demand, historically by the growth flip-chip bumping an WLCSP passivation steps.
PBO, epoxies, WPR and AL-X recently entered the market thanks to the recent growth demand in 300mm WLCSP, FOWLP and emerging 3DIC applications.
This research will cover :

Global materials market forecast
Global forecast breakdown by application
Global forecast breakdown by function
Detailed market breakdown of permanent dielectrics by material, supplier, account

There is a wide range of polymeric material available on the market. This study will feature:

Chemistries and history of key microelectronic polymers
Properties, pros & cons for each solution
Applications by polymer type
Processing considerations

NEW FUNCTIONS OF POLYMERIC MATERIALS ARE LEVERAGING BURGEONING WLP MARKET Today demand is driven by FC wafer bumping, fan-in WLCSP and thin-film IPD. Tomorrow, significant demand will shift to FOWLP, 3DIC stacks, 3D WLP, and 2.5D interposer substrate platforms.
Types of polymeric materials covered:

Permanent dielectric polymers
Thick plating resists
Temporary bonding & de-bonding adhesives
Hard mask resist for DRIE etch
Wafer-level underfills
Wafer-level molding compounds
Adhesive tape (BG/Dicing tape)

DETAILED MATERIAL SUPPLIER PROFILES
Corporate profiles detailing financials, employees, polymer products for wafer level packaging and selected properties of these products are compared and contrasted for: 3M, Ajinomoto, Asahi Glass, Asahi Kasei, Brewer Science, Cookson, Dow Chemical, Dow Corning, DuPont, HD Microsystems, Fujifilm, Hitachi Chemical, Henkel, JSR Micro, Lord, Namics, Nitto Denko, Nippon Kayaku, Shin Etsu, Silecs, Simitomo Bakeite, TOK and Toray.
WHO SHOULD BUY THIS REPORT?
Material suppliers

Assess the TAM ( total accessible market) for your company's polymeric products
Identify tech trends, challenges and requirements for each 3DIC / WLP scenarios. Are their markets you could be serving?

Materials users (IDMs, Wafer Foundries, Packaging Houses)

Identify competitive materials, What are others using ?
Consolidate suppliers by understanding their full product offerings

Equipment Vendors

What materials should you be developing processes for ?
What are the technology trends ?


ADVANCED PACKAGING : Polymeric Materials for 3DIC & WLP Applications: , is available at:
http://www.reportbuyer.com/industry_manufacturing/packagi...