“Power Electronics for Wind Turbines” added to ReportBuyer.com

April 30, 2012 - PRLog -- ReportBuyer.com has added a new report http://www.reportbuyer.com/go/YOL00170
Summary of Report  -

Chinese Players Are Now Worldwide Leaders!

China has protected its market: With the huge local growth, Chinese players are now leaders in wind turbine manufacturing and they are looking at expanding globally. In three years, the top-5 players ranking has been totally changed, and with the recent acquisitions (GE over Converteam) or affairs (AMSC against Sinovel), it will change again.

This report includes a focus on the Chinese market, with local market and players split, as well as future market trends.

Moving From DFIG to Full converter has a Large impact on passives

The supply-chain is moving, and you will get the tools to understand this evolution in this report: With the integration trend, we will see more and more companies manufacturing or supplying several passives at a time, assembled together, to gain in added value. The components are to be pre-assembled in stacks, and the final integrator will choose the power switch.

Laminated busbars are fully part of this integration trend as they connect all these components together. Mersen announced recently the acquisition of Eldre, third player of the busbar market. On the other hand, Chinese players such as Eagtop, or CSR are gaining in experience of laminated busbar manufacturing. Globally, the market is on growth trend reaching $44M in 2017, following the need of higher power converters.

According to most players, the capacitor market is not expecting a technical breakthrough, but footprint and integration skills will give advantage to the players who mastered it. The polypropylene film shortage is now over, and the market is not as tense as it used to be.

The resistor market is suffering from the move to full converter design. The design of grid fault protection systems requires less very high power resistors, and thus, the crowbar resistor market will diminish by 7% in the 2010-2017 period. DC link chopper is using the same technology and the move will fuel this 16% growth market.

Globally, technical evolutions have very high impact on passive components market. But these impacts, detailed in this report, are very different from one to the other.
Silicon Carbide Will Come Starting 2015: Meanwhile, Power Module Improvements Will Be At Packaging Level

IGBT is the device best fitting the wind converters, either in power modules or stackpacks. Converter manufacturers are waiting for the availability of Si/SiC hybrid and full SiC modules. But when we look at today's situation for 1200V discrete devices, the lack of reliability, and volume production at reasonable cost will make the wind market wait before SiC introduction, as explained in the roadmaps as well the semiconductor dies and materials market forecast of this report.

Packaging is evolving. Innovations are targeting all high power conversion markets, and they will bring better performance:

   Infineon is bringing copper into the module, for die attach and connections
   Semikron keep bringing silver into the modules, with sintering method.

First analysis from this report shows that copper is the next standard as it will be used by most players, even if Semikron's sintering can target +30% market share.

Power Electronics for Wind Turbines: Market & Technology Report, is available at:
http://www.reportbuyer.com/energy_utilities/alternative_r...