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Follow on Google News | Save Thousands of Dollars in Semiconductor Thermal Simulation with ATS’s HFC-100Advanced Thermal Solutions HFC-100 simulates semiconductors capable of dissipating 1kW of heat over 1k /cm2. The HFC-100 replaces the need for costly silicon samples early in the physical design process, saving engineers thousands of dollars
By: Advanced Thermal Solutions, Inc. Deploying the HFC-100 makes it possible to replace expensive semiconductor samples typically used early in the design process as part of system’s thermal design. By having equipment like the HFC-100 available, engineers can get an early jump on a project’s thermal design. Doing so improves the likelihood of a successful design the first time, reducing a potential project bottleneck if attempted further down a project’s design cycle. The HFC-100 is capable of transient steady state and transient measurements. It can accommodate up to eight thermocouple sensors for precise temperature measurement. Engineers can dynamically control the power levels and dynamically measure the resistance of the heating element for accurate dissipation calculation. The instrument automatically shuts off if the heater temperature rises above the user defined protocol. This HFC-100 features ATS proprietary fluxSTAGE™, a LabView™ application, which automates the use of the system and allows the user to choose multiple heat loads at a specific dwell time. The program calculates the thermal resistance of the cold plate for desired cooling of the die and measures the simulated junction’s temperature. The HFC-100 is available now and more information may be found at http://qats.com/ # # # ATS - Advanced Thermal Solutions, Inc. - Celebrating 20th year - is a leading engineering and manufacturing Co. supplying thermal and mechanical packaging products for the electronics industry. Contact ats-hq@qats.com or visit our website at www.qats.com End
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