Interface IC transfer to the small size of SFP +

Nov. 30, 2010 - PRLog -- The interface chip industry as a whole number of suppliers on the rise, which is currently in support of data communications and telecommunications router / switch tailored to the SFP + conversion chip. SFP + 10Gbps Ethernet and 8.5Gbps for Fibre Channel (Fibre Channel) system, the latest pluggable fiber optic module sizes. SFP + X2 and XFP packages with more than compact size, and power consumption less than 1W. In addition, it offers higher than the current 10Gbps device mounting density. A new design has been made more SFP + has the SFP (small form factor pluggable) industry standard the same volume, which for the application of the data rates of up to 4Gbps.
In addition to the new standard fiber GLC-SX-MM by moving everything outside of the module external costs. Signal modulation module to move from the board cards, serial / deserializer, MAC, clock and data recovery (CDR), and electronic dispersion compensation (EDC) function is no exception. This treatment is charged by light / electricity conversion polarization mode dispersion (PMD) function in a simplified transceiver module.
Currently the industry has been to three 10Gbps network for the scope of the SFP + standard: 10GBase-SR (using OM3 multimode fiber level, 30 ~ 300m), 10GBase-LR (using single-mode fiber, 10km), 10GBase-LRM (using FDDI grade multimode fiber, 220m).
Not long ago, Avago Technologies (Avago Technologies) in volume to provide 10Gbps Ethernet SFP + short-range (SR) optical transceiver products - AFBR-700SDZ. The core of the product is high Anwar full use of its 4G VCSEL design advantages of its own 850nm vertical cavity surface emitting laser (VCSEL). According to Avago said its early design has withstood more than 20 billion devices (device-hours) of trouble-free testing. AFBR-700SDZ multi-mode fiber (MMF), and communication coverage extended to 300m.
AFBR-700SDZ transceiver supports enhanced 10Gbps SFP + for the SFF-8431 specification, and for the optical transceiver digital monitoring interface (DMI) of the SFF-8472 specification. AFBR-700SDZ meet product/file506product/searchfile/1053product/searchfile/519product/searchfile/1194

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Renesas Technology Corp. SFP-H10GB-CU3M(Renesas Technology Corp.) Recently announced its lineup of environmentally friendly halogen-free resin diode will increase by 5 new products: PIN Diode HVL142AM-N (TEFP package), HVL142-N (EFP package); Schottky diodes HSL226- N (EFP package), HRD0103C-N (SFP package) and HSD226-N (SFP package). New products using environmentally friendly alternative to halogen aluminum bromide as a flame retardant epoxy resin. PIN diodes used in mobile phones and wireless LAN equipment and other mobile devices transmit / receive switch; Schottky diodes are used in mobile phones and wireless LAN equipment and other mobile devices testing mixers and switching power supply.
Halogen-free packaging diode characteristics are as follows:
Used in accordance with Underwriters Laboratories (Underwriters Laboratories) UL 94 V-0 certified standard halogen-free flame retardant epoxy resin will be used to change from aluminum hydroxide, bromine, contribute to the achievement of the resin used for the diode package safety testing laboratories through the U.S. standard UL 94 V-0 certification. Do not use halogen can reduce the overall environmental impact. The reliability and features provided by the equivalent of the current diode: will be used instead of aluminum hydroxide flame retardant epoxy resin reliability or diode characteristics will not have a negative impact. New diode with the current product equivalent to each other instead. Development Background
Renesas Technology is committed to SFP+ transceiver environmental protection, including compliance with EU Restriction of Hazardous Substances Directive (RoHS) for the transfer to lead-free solder. In the semiconductor molding epoxy resin is used as flame retardants of bromine RoHS directive does not limit the material, but it is considered a negative impact on the environment. Against this background and taking into account environmental impact, Renesas Technology has now passed with a material manufacturer, to develop a method of using aluminum hydroxide as a substitute for bromine, and can guarantee the performance of the same flame retardant technology. First, the adoption of Renesas Technology MP6 package RKV653KP products such as varactor diodes used in this new technology. These new products expand the TEFP, EFP and SFP package series and has begun supplying samples was December 8, 2006 the first supplier in Japan.

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