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Reflow Oven Video Released for Surface Mount Printed Circuit Board Assembly from APS Novastar
Reflow oven video providing overview of technology and Reflow Oven products from APS Novastar for lead-free and lead based reflow soldering, curing, and thermal cycling applications.
The company's Reflow Oven product line consists of compact benchtop reflow ovens to higher volume production models. The video details the many unique features of the company's Reflow Oven product line. Also illustrated is the company's patented Horizontal Convection™ technology, which enables APS Novastar Reflow Ovens to provide highly accurate, consistent, and reliable thermal profiles for exceptional reflow results. The Horizontal Convection technology, which creates a cyclone of air circulated around the printed circuit board, provides improved thermal penetration across the board and yields better results with tough-to-solder components such as BGAs and J-leaded quad flat packs.
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APS Novastar, LLC, established in 1982, recipient of a 2009 Frost & Sullivan Best Practices Award, is the global leader in the design, development and manufacture of OEM equipment for the short to medium run surface mount technology (SMT) and printed circuit board (PCB) markets. APS Novastar's products include stencil printers, automated pick and place robots, reflow ovens, wave and selective solder equipment, component counters and lead forming equipment. APS Novastar has installed over 20,000 product solutions in the telecom, defense and aerospace, security, transportation, automotive, medical device and diagnostics, personal computer, display and academic markets. For more information, visit http://www.apsgold.com or call +1.215.938.1000.