Unprecedented Result from NAFEMS World Congress 2015 Call for Papers

SAN DIEGO - Dec. 18, 2014 - PRLog -- NAFEMS, the International Association for the Engineering Analysis Community, has announced that over 400 abstracts have been submitted for its 2015 World Congress (http://www.nafems.org/congress/) in San Diego, USA – the highest response level yet for this biennial event.

The call for abstracts, which closed on November 17th 2014, saw papers submitted from across the globe, covering every aspect of simulation technology from multiple industries. The biennial world congress will bring together the leading visionaries, developers, and practitioners of CAE-related technologies and business processes to share relevant trends and roadmaps, explore common themes, and to address these issues in an open forum. The aim of the congress is to provide attendees with perceptive content and perspective on the best way to position their organisations to realize the full potential of CAE both now and in the future.

One Registration – Two Conferences
The World Congress, which welcomes SIMULIA as Platinum Sponsor, will also host the 2nd International Conference on Simulation Process and Data Management. After an impressive turnout for the first event in Salzburg, Austria in 2013, this ground-breaking conference will bring together industrial users, technology experts, academics and software vendors alike, allowing all those with an interest to take part in the only truly independent, international forum dedicated to SPDM. Attendees, speakers and exhibitors have free access to both events under one registration.

Unprecedented Response
“We are delighted that the simulation community has engaged with the NAFEMS World Congress 2015 in the way they have so far”, said Tim Morris, NAFEMS’ CEO.“To have over 400 high-quality abstracts submitted for the event demonstrates that the engineering analysis society is eager to share experiences and develop their knowledge through presenting at and attending the 2015 Congress.”

As well as covering a wide range of topics, addressing every aspect of engineering simulation & SPDM  in a packed three-day programme including presentations, workshops, discussion forums and a comprehensive exhibition, the Congress will also play host to a number of dedicated forums, focussing on topics such as 3D printing & additive manufacturing, CFD, systems engineering, composites, reliability and robustness, coupling, multiscale analysis, adaptive meshing, automated meshing and many more.

“It is vital that NAFEMS continues to explore all aspects of CAE, including up and coming hot topics”, added David Quinn, Chief Marketing Officer at NAFEMS. “The World Congress will provide an independent view of a multitude of technologies and methods, with input from some of the leading industrial and academic minds.”

Registration for the World Congress will open in early 2015, with the full agenda being launched in February, and there are still many opportunities to get involved, either in the Congress program, or through exhibition and sponsorship. Visitwww.nafems.org/congress for full details.