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T&S and US Conec Ink Global Licensing Deal on MDC Technology to Advance High-Density Optical Interconnects

By T&S Communications Co., Ltd.

(OFC 2025) – During the OFC 2025 conference, T&S Communication and US Conec formally entered into a global patent licensing agreement covering MDC connectors and adapters.

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MeetGeek Launches AI Voice Agents That Speak, Ask Questions, and Lead Meetings Autonomously

ZapperBox NextGen TV Gateway Receiver Now Testing Support For Secure Whole-Home Content Distribution

Harvesting Hope: A Plan to Restore the Promise of California Agriculture

TKL Group's New Factory Commences Production, Pioneering A New Era In Global Heavy Duty Truck Parts

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