coolingZONE-13 International Business and Technology Summit Call for Papers

coolingZONE-13, the International Business and Technology Summit has opened their call for papers. The Summit covers emerging technologies in thermal management, electronics cooling, heat transfer and energy transport
 
Oct. 28, 2012 - PRLog -- coolingZONE-13, the International Business and Technology Summit, has opened their call for papers. The conference is scheduled for October 23-25th, 2013, in Cambridge, Massachusetts, October 23-25th.  The Summit is appropriate for technical papers on topics concerning thermal management, heat transfer, electronics cooling and energy transport.

The annual summit, now in its 13th year, brings together world experts in thermal management to present the latest developments in this important and fast growing field. The Summit covers emerging technologies in thermal management, electronics cooling, heat transfer and energy transport.

Presenting papers is a time-honored opportunity to gain peer recognition and make a mark on this important industry.   For anyone involved in applications that bring novel approaches to thermal management, this is the forum for presenting a paper to the international marketplace.   Abstracts will be considered by a panel of thermal experts looking for innovative work within these important areas:

•          Electronics Thermal Management For High Power ICs and Systems

•          Data center cooling and containerized cooling solutions

•          Energy Generation, including Wind Turbines and Solar Energy Generating Systems

•          LED Thermal Management and Control

•          Electric Car and Battery Thermal Management

•          IC Packaging for Improved Thermal and Electrical Performances

•          Thermal Management in Bio-Sciences

•          Cold Plates and Spray Impingement Solutions for Industry

•          Advances in Thermal Modeling and Computational Solutions

•          Thermal Measurement Advances, Options and Instruments

•          Control Technologies in Thermal and Energy Management for Electronics Equipment

•          Advances in Thermal Management of Embedded Computing

You may submit your 500 word minimum abstract supported by figures, tables and references as appropriate, to coolingZONE at this web site address http://www.coolingzone.com/event.php?eventid=41

Abstracts submission deadline is June 14th, 2013.  Authors Notifications are scheduled for July 12th, 2013 and Completed papers deadline is September 1st, 2013

For more information, visit coolingZONE.com or email cz-info@coolingzone.com
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Tags:Thermal Management Conference, Heat Transfer Conference
Industry:Engineering
Location:Quincy - Massachusetts - United States
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