There are two parts to this outstanding program: A design challenge AND course in thermal management and electronics cooling
Take the 6Sigma CFD Modeling Challenge…Win an iPAD!
Contestants will apply thermal modeling best practices learned in the coolingZONE 2-Day Short Course on Thermal Management of Electronics in a live CFD model building contest. Compete against fellow mechanical engineers in a hands-on battle to design a heat sink thermal solution that will produce the lowest component junction temperature.
Participants will use 6SigmaET, a new generation of electronics thermal simulation software from Future Facilities. Competitors will build a pre-defined system based on a common set of model parameters including boundary conditions, library items and materials. Choose the optimum combination of heat sink, thermal interface material, heat pipe and component location to keep vital components below their thermal limits. No prior experience or training is required to model with 6SigmaET. Register on-line at coolingZone.com to attend this informative and fun 2-Day event and use your modeling skills to win an iPAD courtesy of Future Facilities and may the best design win!
Take the course: "Thermal Management of Electronics - Calculations, Measurements, Simulation, Review and Selection of Cooling Options".
Attendees will be taken from the basic definition of electronics cooling and why thermal management is required; to how to calculate certain parameters; to how to accurately measure them; and to where and how to use simulation tools like CFD, for effective thermal management. These include:
- Fundamentals of Electronics Cooling – what it is; why it needs to be considered; how it is approached and what needs to be considered.
- Required Calculations in Thermal Management – a set of calculations and respective procedures for analytical modeling of components, boards and systems.
- Effective Characterization – The Role of Measurement in Thermal Management – basic principles of measurement are examined and proper practices for temperature, velocity, pressure and heat flux are reviewed.
- The Role of Software in Thermal Management—CFD Simulation- understanding the fundamentals of CFD simulation and reviewing the best practices in modeling electronic components, boards and systems.
The course will also cover the features, selection and salient characteristics of different cooling systems. These include: selection and design of heat sinks and thermal interface materials, fan selection and characterization, and their role in electronics cooling. The use of vapor chambers and jet impingement for cooling of high power components and boards will also be reviewed. The session ends with an extensive review of cooling solutions that has been developed from vacuum tube to modern high power electronics This course is applicable to all market sectors: from LEDs and consumer electronics to space and military applications.
Act Now as Early Registration pricing saves you $300! The course is $1,295.00 until mid-night 11/25, $1595.00 11/26 until the day of the course. Send more than one engineer and get a further 10% discount. Please see our web site at this link for more details http://www.coolingzone.com/