Dr. Satish Kandlicker of RIT will share his research on novel pin fin heat sinks designs with liquid cooling. A novel design with variable fin density is proposed to generate a more uniform temperature of the IC chip junctions. The variable-density feature allows the gradual increase of the heat transfer area as coolant passes through the system. Single-phase water in the laminar regime is employed. Four different fin shapes (circle, square, elliptical, and flat with two redounded sides) are analyzed. The junction temperature and pressure drop variations in the heat sink generated by these shapes are presented. The effects of varying the fin length and height are also studied. The best heat sink configuration has a thermal resistance ranging from 0.14 to 0.25 K/W with a pressure drop lower than 90 kPa and a junction temperature ~ 314 K under the conditions studied. The temperature gradient at the bottom wall of the heat sink is considered as a parameter for comparing various heat sink designs. The novel cooling device has an overall temperature gradient lower than 2°C/mm, which is significantly lower than the temperature gradients in other schemes reported in literature.
Norbert Engelberts of Optimal Thermal Solutions will discuss best practice in accurate LED thermal characterization. The presentation will discuss the combination of analytical modelling, computational modelling and experimental testing to help the designer to come up with the most optimal solution and how the final product need to be verify by thermal characterisation and measurements and the challenges involved in doing this. Participants will get an understanding of the methods available to perform accurate thermal characterization and measurement on LED products and understand the need for using experimental testing next to analytical and Computational modeling.
The coolingZONE eConference series feature monthly online training taught by world class experts in thermal management and heat transfer. Each month, two to three hours of important topics in thermal management, heat transfer, electronics cooling and thermal transport are provided for $99.00 for a month's sessions. The $99.00 fee include an unlimited access to the recorded versions and the speaker notes (when provided by the speakers). eConference topics and speakers are in place for October, November and December of 2012. For more information and to register, please visit: http://www.coolingzone.com/