Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications

A new semiconductor industry report entitled Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications, forecasts increased demand for leading-edge semiconductor precursors. The market for advanced precursors used in semiconductor devices is expected to grow 40% to almost $3B by 2017, according to the new report. The report was developed by by Linx Consulting, the premier consultant to the electronics industry materials industry.
 
advanced thin film deposition growth ($basis) across all deposition technologies
advanced thin film deposition growth ($basis) across all deposition technologies
BOSTON - June 13, 2013 - PRLog -- The semiconductor industry has relied on CVD and PVD technologies to meet much of the requirements in thin film depositions. Along with these process technologies, many standard materials, such as SiO2, Al and Ti, have been re- lied on to meet a majority of the industry's needs.

In the 4th edition of Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications, the industry is facing challenges in its path to continue scaling, which is leading to the adoption of many new structures as well as new materials, including:

• Rapid growth in novel metals gates and high-κ gate dielectrics
• Rapid growth in spacers used in lithography for pitch doubling applications
• Next generation barrier and seed materials
• High-K dielectrics and 3D structures in NAND

This growth in advanced precursors is across all thin film deposition technologies, including atomic layer deposition, electrochemical deposition, spin-on processing, SACVD, and CVD, as outlined in the 4th edition of the Linx industry analysis report, Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications 2012 - 2017.

In addition to growth rates by deposition technology, Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications 2012 - 2017 also includes forecasts for materials consumption 2012-2017, an analysis of the leading suppliers and a technology review of emerging FEOL, BEOL and memory applications, including High mobility non-planar transistor structures, emerging barrier materials, spacers and advanced in DRAM and NAND structures.

Linx Consulting is the leading electronic materials consulting firm, serving the semiconductor, photovoltaics, and electronics industries worldwide. The firm develops unique insights and creates knowledge at the intersection of advanced thin film processing and performance chemicals and materials.

To obtain more information about this report contact Mike Corbett at mcorbett@linx-consulting.com telephone +1-973-437-4517 or Mark Thirsk at mthirsk@linx-consulting.com, telephone +1-617-273-8837. More information about Linx Consulting can be found at http://www.linx-consulting.com.

Photo:
https://www.prlog.org/12156263/1
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