The reliability of electronic devices is particularly reliant on the integrity of solder joints and interconnects, which are estimated to account for 70% of the failures in electronic devices. As electronic devices are powered up and down, interconnect elements are subject to thermal cycling, which, working in combination with vibration and shock loading, creates stresses which cause fatigue in the interconnect and solder joint materials. Dr Robert Tryon, VEXTEC CTO and co-founder, said, "Material failure is considered a primary cause behind electronic device failures. The application of Virtual Life Management modeling techniques provides for improvements in the understanding of electronic system reliability and allows for significant reductions in bench testing."
"These two patents represent another validation point in VEXTEC's unique computational modeling capabilities and demonstrates the opportunities to accelerate product development and time to market for the electronics industry" according to VEXTEC CEO James Allen. "We look forward to bringing this capability to the global electronics industries."