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VEXTEC Awarded Two Patents for Virtual Life Management Technology Applications in Electronic Devices

VEXTEC has been awarded two patents which protect its intellectual property related to using probabilistic, material modeling technology to determine durability of electronic devices and accelerate product development.

Nov. 20, 2012 - PRLog -- The U.S. Patent & Trademark Office recently awarded VEXTEC Corporation its sixth (Patent No. 8285522) and seventh (Patent No. 8290753) patents protecting the intellectual property upon which the company's Virtual Life simulation technology is built. The patents specifically address the use of Virtual Life Management simulation technology, which uses probabilistic, microstructure material modeling technology to predict durability, in the design of electronic devices.

The reliability of electronic devices is particularly reliant on the integrity of solder joints and interconnects, which are estimated to account for 70% of the failures in electronic devices. As electronic devices are powered up and down, interconnect elements are subject to thermal cycling, which, working in combination with vibration and shock loading, creates stresses which cause fatigue in the interconnect and solder joint materials.  Dr Robert  Tryon, VEXTEC CTO and co-founder, said, "Material failure is considered a primary cause behind electronic device failures. The application of Virtual Life Management modeling techniques provides for improvements in the understanding of electronic system reliability and allows for significant reductions in bench testing."

"These two patents represent another validation point in VEXTEC's unique computational modeling capabilities and demonstrates the opportunities to accelerate product development and time to market for the electronics industry" according to VEXTEC CEO James Allen. "We look forward to bringing this capability to the global electronics industries."

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***@vextec.com Email Verified
Source:VFA Engineering Group
Location:Brentwood - Tennessee - United States
Tags:Durability, Electronics, Solder Joints
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