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Follow on Google News | PA&E Announces New Flexible Lead EMI FiltersFlex Lead Delivers New Levels of Reliability and is Available in Both Bolt and Broadband Package Configurations
PA&E’s Flex Lead filters offer a number of advantages over more conventional EMI filtering approaches. Flex Lead filters can deliver higher levels of reliability because its design eliminates a solder joint that is often prone to fatigue. And, since the lead insulation is encapsulated inside the filter body, the potential for accidental shorting is reduced. “Our new Flex Lead EMI filters are a great compliment to our extensive line of EMI filters,” said Ed Phinney, Vice President of Engineering at PA&E. “Electronic component designs are becoming increasingly complex and these new filters give engineers a little more design freedom. They can also make the production process more efficient by eliminating the need to install connecting leads,” he added. PA&E’s Flex Lead EMI filters have an operating temperature range of -55°C to 125°C and are rated for 50 to 500 VDC. Insulation resistance is 100G Ohm (minimum) at 25°C and its capacitance range is 1000pF to 20nF. The case is constructed of cold-rolled steel that’s finished with a gold-over-nickel under-plate and copper is the standard lead material. Every PA&E EMI filter has been ruggedized and completely encapsulated, resulting in an environmentally resistant unit intended for high-reliability military and aerospace applications. All parts, whether they are epoxy resin or hermetically sealed devices, meet or exceed the applicable requirements of MIL-F-15733 and MIL-F-28861 specifications. PA&E manufactures several types of EMI filters including: mini eyelet, micro screw-in, eyelet style, filter pin, bold, broadband styles. For more information about PA&E’s Flex Lead EMI filters, or to learn more about the company’s other interconnect products and integrated electronic packaging capabilities, contact PA&E at 509-664-8000 or visit us at http://www.pacaero.com. # # # PA&E, Inc. manufacturers technically demanding ceramic and metal components and assemblies, hermetic connectors and advanced micro-electronic hermetic packaging for global leaders in the defense, space, medical and commercial industries. End
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