Move2THz Advances Sustainable Semiconductor Innovation for Future (Sub-)THz Applications

BERNIN, France - Jan. 5, 2026 - PRLog -- [Bernin, France] — Move2THz, a European collaborative initiative developing a Sustainable Indium Phosphide-on-Silicon (InPoSi) platform and ecosystem, is advancing next-generation high-frequency semiconductor technologies to enable future mass-market (sub-)THz applications. The project tackles key limitations of today's Indium Phosphide (InP) solutions and supports the development of a mature European value chain capable of delivering scalable, commercially viable, and environmentally responsible components for emerging wireless and sensing markets.

Move2THz contributes directly to the European Green Deal and the EU's ambition to become climate-neutral by 2050. By combining sustainability with technological sovereignty, the project promotes resource-efficient innovation while strengthening Europe's industrial competitiveness and resilience in advanced semiconductor manufacturing.

At the heart of Move2THz is the development of a high-performance InPoSi technology platform designed to push performance toward THz frequencies while reducing dependence on scarce materials. This approach is intended to lower the environmental footprint of manufacturing and support Europe's transition toward a circular and sustainable semiconductor economy. By establishing an integrated and responsible value chain, the project is building a future-ready ecosystem that combines scalability, performance, and measurable sustainability outcomes.

Sustainability is a central pillar of Move2THz, with a strong focus on reducing CO₂ emissions across the entire product life cycle — from raw material sourcing and production to operation and end-of-life recycling. The project is optimizing InPoSi manufacturing to reduce energy use, minimizing rare material consumption, strengthening eco-friendly European supply chains, and applying Life Cycle Assessment (LCA) methods to quantify environmental benefits.

Move2THz is also pioneering a transformative reduction in InP usage through the Smart Cut process and advanced wafer reclaiming, allowing donor wafers to be reused multiple times and achieving more than a tenfold reduction in raw material consumption. Together, these innovations demonstrate how advanced microelectronics can deliver both industrial excellence and meaningful climate impact reduction, supporting Europe's leadership in a globally competitive, lower-carbon semiconductor future.

More: https://www.move2thz.eu/