Toradex Introduces Two New Computer Module Families for Ultra-Compact Industrial & IoT Applications

HORW, Switzerland - Dec. 4, 2025 - PRLog -- Horw, Switzerland: Toradex today announced the launch of two entirely new Computer on Module (CoM) families, OSM and Lino, expanding its embedded computing portfolio with four new modules powered by NXP® i.MX 93 and i.MX 91 processors: OSM iMX93, OSM iMX91, and Lino iMX93, Lino iMX91.

Designed for high-volume, space-constrained industrial IoT devices, the OSM and Lino families deliver cost-optimized, industrial-grade reliability, offering ultra-compact form factors, and long-term software support for industrial controllers, gateways, smart sensors, and handheld systems, among others. For AI at the Edge, Industrial IoT applications, the NXP i.MX 93 offers a 0.5 TOPS NPU, enabling entry-level HW accelerated on-device machine learning for smart sensing, analytics, and industrial intelligence. Designed for extreme temperatures from -40°C to +85°C, both the OSM and Lino families deliver industrial-grade reliability and availability through 2038, providing a future-proof foundation for next-generation IoT and edge devices.

Both families deliver new compact, reliable, industrial Edge AI compute platforms", said Samuel Imgrueth, CEO at Toradex. "While OSM adds a solderable standard form factor, Lino provides connector-based ease of use for rapid integration and serviceability. This empowers customers to design next generation, intelligent, space-constrained devices with confidence, scalability, and long-term support.

OSM Family: Solderable, Ultra-Compact, Open Standard

The OSM family adheres to the Open Standard Module™ (OSM) Size-S specification, providing a 30 × 30mm solderable, connector-less design optimized for automated assembly, rugged operation, and cost-effective scaling. It's an ideal choice for high-volume applications up to several hundred thousand devices a year.

Lino Family: Connector-Based Flexibility for High-Volume Devices

The Lino family provides a cost-optimized, connector-based entry point for space-constrained devices. Its easy-to-use connector interface simplifies integration, serviceability, and speeds up development, while rich connectivity options support a wide range of scalable industrial and IoT applications.

Toradex is also introducing the Verdin-Lino Adapter, allowing any Lino module to be mounted onto any Verdin-compatible carrier board. This gives customers immediate access to the powerful Verdin ecosystem and enables testing and validation using both the Verdin Development Board and existing Verdin-based custom designs.

Press Release Link: https://www.toradex.com/news/lino-osm-imx91-imx93-launch