FIBERSTAMP to Showcase Immersion Liquid-Cooled 800G Optical Module &800G Optical Extender at SC 2025

CHANGI, Singapore - Nov. 8, 2025 - PRLog -- FIBERSTAMP will showcase its latest generation of liquid-cooled optical interconnect solutions at the Supercomputing 2025 (SC 2025) exhibition, taking place in St. Louis, USA, from November 16 to 21, 2025.

At Booth #4008, FIBERSTAMP will present a live demonstration of its immersion liquid-cooled 800G optical module and 800G optical extender series, welcoming industry professionals to explore the company's newest innovations in AI and HPC connectivity.

Live Demonstration Highlights:

Immersion Liquid-Cooled 800G Optical Module (800G OSFP DR8 Silicon Photonics Module)

Designed for high thermal density AI clusters and liquid-cooled data centers, this fully immersion-ready optical module features:

AI-Grade Liquid Cooling Design: Supports complete immersion operation with MPO tail-fiber interface.
High-Reliability Hermetic Structure: Withstands >0.2 MPa pressure; incorporates integrated heat-dissipation materials and an inspection valve with patented mechanical design.
Flexible Connectivity: Pluggable Dual MPO12 tail fibers, compatible with AOC and liquid-cooled cabling architectures.
Silicon Photonics Architecture: Combines high bandwidth with low power consumption to meet future high-speed computing cluster demands.
Wide Fluid Compatibility: Validated with fluorocarbon, mineral oil, and silicone oil cooling fluids; customizable for customer-specific immersion environments.

Liquid-Cooled Optical Extender Series

To enhance flexibility and maintainability in high-density liquid-cooled systems, FIBERSTAMP is also introducing a range of 800G liquid-cooled optical extenders, including:

800G OSFP Liquid-Cooled Extender
800G OSFP-RHS Liquid-Cooled Extender
800G QSFP-DD Liquid-Cooled Extender

Technical Highlights:

High-Speed Core Design: Supports extension up to 0.5 meters (0.3 meters for 800G) and features FIBERSTAMP's patented "fish-shaped" housing.
Multi-Form Factor Compatibility: Supports SFP112, QSFP28, QSFP-DD, and OSFP, covering 25G to 800G with a seamless upgrade path to 1.6T.
Enhanced Cooling Capability: Built-in 1.5W silent fan improves airflow and significantly boosts connector thermal performance.
Visual Status Monitoring: Integrated indicator lights for active status visualization, ideal for high-frequency plug-and-play environments and port lifespan extension.

Driving Innovation in High-Performance Optical Interconnects

FIBERSTAMP continues to advance data center interconnect technology through innovation, empowering global AI and HPC systems with higher energy efficiency, greater bandwidth, and improved reliability.

Visit FIBERSTAMP at Booth #4008 during SC 2025 to experience the next generation of immersion liquid-cooled optical interconnect solutions firsthand.

Learn More: https://www.fiberstamp.com/news-14004.html