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| Minus K Technology Announces Its Tenth Educational Giveaway of Vibration IsolatorsTo continue to support academia, Minus K is giving away $25,000* dollars worth of their patented superior performing passive mechanical negative-stiffness low-frequency vibration isolators to colleges in the United States.
By: Minus K Technology To continue to support academia, Minus K is giving away $25,000* dollars worth of their patented superior performing passive mechanical negative-stiffness low-frequency vibration isolators to colleges in the United States. If you have an AFM, Electron Microscope, Interferometer, Laser Optical System, Micro Hardness Tester, or any other special equipment that would be assisted by our vibration isolation, simply fill out the attached form and send it back to edgiveaway@minusk.com. If you're one of the top applicants, we'll send you one of these free vibration isolators to assist you with your research. Recipients of a Minus K isolator will be chosen based on the proposed use and applicability of the isolators. The grant application must be signed by a department head of the institution, then returned to Minus K via email (edgiveaway@ Grantees will be interviewed approximately six months after receiving their equipment to learn how their Minus K vibration isolators helped them reach the goals of their application. The interviews will be used for articles in industry publications. The grantee departments will be notified via email and the results will also be posted on Minus K's website (www.minusk.com). The selected departments will receive their new Minus K vibration isolator within two month of notification. Don't miss out on the opportunity to receive the best sub-Hertz low frequency vibration isolator on the market! * $25,000 of retail products will consist of at least one each of the following standard models of Negative-Stiffness vibration isolators: WS-4, BM-1, BM-4, BM-8, BM-10 and CM-1. Based on the information provided within grant forms Minus K may substitute different models to best accommodate the application and payload needs. End
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