Au-Sn Solder Paste Market Analysis and Forecast (2021 - 2030)

Au-Sn Solder Paste Market - Global Market Analysis and Forecast (2021 - 2030)
INDORE, India - March 24, 2023 - PRLog -- Au-Sn solder paste is used for applications requiring a high melting temperature. It is available in a variety of solder paste forms with different options suited to specific applications. Due to its good thermal fatigue properties, it is widely used in applications requiring high tensile strength and corrosion resistance. When used in step soldering applications, Au-Sn solder paste will not melt when reflowed at low temperatures.

Au-Sn solder paste, which is made from gold and tin and has a relatively low melting point, is commonly used for fabricating RF devices. This paste provides a strong electrical connection between two surfaces even when exposed to high temperatures. With the increasing demand for more powerful and spectrum-efficient mobile devices due to the shift from 2G to 5G technologies, there is a rising need for Au-Sn solder paste in order to maximize power efficiency and spectrum range. This increased need is likely to lead to more market growth of such solder paste

The demand for Au-Sn solder paste has been on the rise, driven by the rapid expansion of the opto-electronic devices market. The paste is composed of a combination of gold and tin, boasting excellent electrical and thermal conductivity. As consumer electronics & automobiles start incorporating more infrared components, healthcare seeks improved imaging & optical sensing solutions, and physical properties of opto-electronic sensors position them to work in abrasive conditions, these factors have all furthered the growth of opto-electronic devices which ultimately increases demand for Au-Sn solder paste

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This report provides a comprehensive overview of the global au-sn solder paste market. It includes key market data from prominent players in the industry, such as Mitsubishi Materials Corporation, Indium Corporation, Chengdu Apex New Materials Co., Ltd., Guangzhou Xianyi Electronic Technology Co.,Ltd and provides an in-depth analysis of the competitive landscape and development trends.
Global Au-Sn Solder Paste Market Segmentation
  • Based on product type, the global au-sn solder paste market is segmented into au80sn20 , au78sn22 and others
  • Based on application, the au-sn solder paste market is segmented into radio frequency devices , opto-electronic devices , saw filter , quartz oscillator and others
Global Au-Sn Solder Paste Market Regional Analysis
The regional analysis chapter of this report provides a comprehensive regional analysis of the au-sn solder paste market, offering insights into North America, Europe, Asia-Pacific, the Middle East and Africa, and Latin America. Country-wise and segment-wise analyses of each region deliver valuable intelligence to market players, aiding them in making informed decisions.
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