News By Tag
News By Location
Follow on Google News
Plasma Treatment for Wire Bond Improvement
Henniker Plasma, a leading manufacturer of plasma surface treatment equipment, presents the latest and most reliable solutions for reducing wire bonding failures.
By: Henniker Plasma
Presence of Contamination is a Common Cause of Wire Bonding Failure
Bond Pad Contamination
Wire bond failure can occur when the fine wire bonds are unable to connect efficiently to a bond pad. Halogen and silicone contamination can cause corrosion and impede adhesion. The formation of corrosion by-products can also become damaging, especially if present at the time of bonding.
Lead Frame Contamination
The lead frames used in the semiconductor device assembly process need to be completely contaminant free. Contamination on the contact surfaces of lead frames can cause a reduction in the quality and provide insufficient bond formation which ultimately impedes adhesion, resulting in complete failure of the whole integrated circuit.
Plasma Cleaning Solutions
Plasma cleaning is regarded as something of an industry standard for wire bonding, efficiently removing organic contaminants and thin oxide layers under high throughput conditions, quickly, efficiently, and reproducibly, greatly enhancing yield and reducing bond failures.
Henniker Plasma is the leading UK manufacturer of plasma treatment systems for cleaning, surface activation to improve adhesion, and functional nano-scale coating. Henniker's systems are known for their reliability and delivery of ultra-fine surface preparation.
Link to the full PR here > https://plasmatreatment.co.uk/
Henniker Plasma - Gill Bolton