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3D Scanning and Inspection System for Microelectronics Unveiled
This new 3DS1010 model is a modular scanning measurement and inspection system utilizing the Keyence LJ-X8000 Series Laser Profiler product line. This comes with a steel NEMA enclosure, is outfitted with a 250mm X 250mm XY stage, and the system includes a manual Z axis for quick positioning and calibration.
Applications include 2D profile and 3D measurement, inspection, and surface defect detection systems for microelectronic components, including other applications such as microelectronic assemblies, medical devices, metal castings inspection, and polymer molded products.
Bold Laser Automation, Inc provides the best in-house turnkey laser automation and automated assembly systems for your pilot and production needs. Whether it be drilling, trimming, ablation, cutting, or welding, each of our team members carries over 30+ years of valuable design experience across numerous manufacturing fields to provide the most cost-effective solutions and systems that are cost-effective and quality-driven.
For more information and product literature, call 1-603-413-5601 / 1-603-493-2579