Exceptional Thermal Properties of Polyimide Films Propelling Their Use in End-Use Industries
In the coming years, the market is predicted to exhibit the fastest growth in the APAC region. This will be a result of the rising requirement for electronics devices made from polyimide films in the regional countries.
By: P&S Intelligence
Other properties of polyimide films such as low weight, excellent tensile strength, flexibility, durability, water sorption, and damp-proof usage also make them viable for the electronics, industrial, aerospace, military, and medical sectors. Moreover, the cost-effectiveness and cut-through resistance characteristic of such films have led to their largescale usage in these industries. Owing to these reasons, the polyimide films market is expected to progress at a CAGR of 10.1% during 2017–2023. The market was valued at $1,850.0 million in 2016 and it is projected to reach $3,608.3 million by 2023.
The surging usage of such films in the electronics, automotive, and aerospace industries has encouraged PI film manufacturers to launch new products and focus on mergers and acquisitions. For example, in June 2017, Kaneka Americas Holding (KAH) Inc., a subsidiary of Kaneka Corporation, acquired the shares of Applied Poleramic Inc., for nearly $15 million. Through this acquisition, Applied Poleramic Inc. became a consolidated subsidiary of Kaneka Americas Holding (KAH) Inc. With this agreement, the latter expanded its product portfolio and increased its penetration of the distribution channel.
Whereas, North America held the second position in the polyimide films market (https://www.psmarketresearch.com/
Thus, the soaring usage of PI films in the electronics, aerospace, and automotive sectors, owing to their excellent chemical, mechanical, and thermal characteristics, is augmenting their production across the world.