VPG Foil Resistors new Space-Saving Flip Chip Resistor is released by New Yorker Electronics
The VPG Ultra High Precision Z1 Foil Technology Flip Chip Resistor with Standoff Delivers a Load Life Stability
The FRFS has a non-inductive, non-capacitive design. It is based on the new generation Z1 Foil Technology of Precision Foil resistor elements by Vishay Precision Group (VPG). The flip chip configuration provides a substantial PCB space saving as compared to a surface mount chip with wraparound terminations. VPG considers it to be the smallest SMD resistor with real ultra high-precision performance.
The standoff construction allows visual inspection of the solder connection after mounting, which is impossible in standard flip chip construction due to close attachment to the PCB. In addition, this construction increases the rated power, due to the increased heat dissipation through the thick terminals.
To acquire a precision resistance value, the Bulk Metal® Foil chip is trimmed by selectively removing built-in shorting bars. To increase the resistance in known increments, marked areas are cut, producing progressively smaller increases in resistance. This method reduces the effect of hot spots and improves the long-term stability of Bulk Metal Foil resistors.
The FRFS Series boasts a resistance range of 170Ω to 1k Ω, including every value within this range. It is available in five different tolerant ranges from ±0.05% through ±1.0% and supplies power to 75mW.
The unique non-hotspot design features more robust solder pads and increases the power rating – field-proven for two years. The FRFS0402 is ideal for demanding applications such as 5G, fiberoptics data transmission networks or high temperature sensors. Its gold-finished solderable terminals are intended for high-temperature applications (above 200°C).
Features & Benefits
New Yorker Electronics