VORAGO Technologies Receives Phase II NASA SBIR Award to Develop High Performance IC
AUSTIN, Texas - Aug. 29, 2019 - PRLog -- VORAGO Technologies, a leading provider of radiation- hardened embedded systems technology, has been awarded a new NASA Small Business Innovation Research (SBIR) Phase II grant by the National Aeronautics and Space Administration (NASA).
The project that is now underway is consistent with VORAGO's integrated circuit technology expertise and is an extension of the successful phase I effort to conceptualize and create an architecture for a rad-hard I/O Expansion chip that is capable of interfacing to next generation spaceflight processor devices including the High-Performance Spaceflight Computing (HPSC) chiplet.
The VORAGO Technologies I/O Expansion chip will be developed to support deep space long- duration missions with extreme needs for low power and energy management, efficiency, fault- tolerance and resilience. The inclusion of an Arm® Cortex®-A5 CPU allows the I/O Expansion Chip to operate autonomously from the HPSC chiplet to facilitate system-level low power operating modes or use as a standalone processor in systems that do not require the throughput of the HPSC chiplet.
"We worked closely with NASA Jet Propulsion Laboratory and other NASA Centers to scope out use- cases and create an optimized chip architecture,"
About VORAGO Technologies
VORAGO Technologies is a privately held, high technology company based in Austin, TX with patented and proven solutions that enable electronics systems for extreme temperature and radiation environments. VORAGO's patented HARDSIL® technology uses cost effective high volume manufacturing to harden any commercially designed semiconductor component for extreme environment operation. VORAGO Technologies opens up a new world of possibilities for your designs, no matter how hostile the environment.